High Frequency PCB | Metal Core PCB | Flexible PCB

RO4350B / 4003C | RT/duroid 5880/ 5870 | RF-35TC / TLY-5

90%  export | UL, ISO 9001, ISO14001 and TS 16949 certified


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RO4350B PCB Built On 4 Layer With Immersion Gold and Black Silkscreen

Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Seba T.

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me:

—— Daniel F

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High Frequency PCB

  • High Precision High Frequency PCB suppliers
  • High Precision High Frequency PCB suppliers
  • High Precision High Frequency PCB suppliers
  • High Precision High Frequency PCB suppliers
  • High Precision High Frequency PCB suppliers
  • High Precision High Frequency PCB suppliers


Just as its name implies, high frequency is that the frequency is relatively high, generally refers to the frequency of >=300 MHz (i.e. wave length <=1m), that is, the usual radio frequency band. The electromagnetic wave of frequency >=1GHz is called microwave.


High frequency printed circuit board or microwave PCB refers to the printed circuit board made on the high frequency (microwave) substrate copper clad plate. The common types are: Double-sided board, multilayer board and mixed structure.

Mixed structure includes high performance special substrate, PP sheet + ordinary performance board and PP sheet mixed pressing board; high frequency substrate + ordinary FR4 substrate; high frequency substrate + metal base etc.


1) The characteristic of low dielectric loss makes the signal loss at a lower level, which makes the signal transmission of the whole equipment excellent;
2) Low water absorbability influences dielectric constant and dielectric loss less at damp;
3) The temperature coefficient of dielectric constant is among the lowest of any circuit board material, making it ideal for temperature sensitive applications;
4) Stable electrical coefficient of dielectric constant;
5) Superior corrosion resistance;
6) The dielectric constant (DK) is low and stable, so the signal transmission is good without delay;


Typical frequencies for wireless applications:
* Current mobile: 0.9GHz - 2GHz
* 3G systems: 2.5GHz
* Bluetooth: 2.5GHz
* GPS: 12.6GHz
* LMDS: 24GHz and 40GHz
* Automotive: 77GHz


RFID, Wireless communications, base station and antenna, amplifier, military products, consumer electronics.

PCB Products and PCB Services
1) Material type: RO4350B, RO4003C, F4(PTFE), RF-35A2, TLA-6 etc.

2) PCB type: Double sided and multilayer PCB.
3) Hybrid of FR-4 and high freqency material combined.
4) RO4350B laminates: 10mil (0.254mm), 13.3mil (0.338mm), 20mil (0.508mm),  30mil (0.762mm), 60mil

5) RO4003C laminates: 12mil(0.305mm), 20mil(0.508mm), 32mil(0.813mm)

6) Base copper 0.5oz and 1oz
7) Solder mask most commonly used: Green and Red
8) Surface finish most commonly used:Immersion gold, copper exposure and HASL
9) Prototype, small batches run and volume production.
10) MOQ: 1PCS.

11) Door to door shipment service

High Frequency PCB Sample Introduction

RO4350B PCB Built On 4 Layer With Immersion Gold and Black Silkscreen

China RO4350B PCB Built On 4 Layer With Immersion Gold and Black Silkscreen Supplier

Large Image :  RO4350B PCB Built On 4 Layer With Immersion Gold and Black Silkscreen

Product Details:

Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0626-V6.26

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: USD20~30
Packaging Details: Vacuum
Delivery Time: 4-5 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp. Final Height Of PCB: 1.6 Mm ±10%
Final Foil External: 1.5 Oz Surface Finish: Immersion Gold (31%)
Solder Mask Color: N/A Colour Of Component Legend: Black
TEST: 100% Electrical Test Prior Shipment

General Profile



RO4350B High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminates(Not PTFE) designed for performance senstive, high volume commercial applications.Currently double sided and multilayer RO4350B PCB are available

from Bicheng company.Double sided RO4350B PCB with thickness 10mil(0.254mm), 20mil(0.508mm), 30mil(0.762mm) and 60mil(1.524mm) are the bestsellers.We provide prototype runs, small batches and volume production services.







1) Excellent high frequency performace due to low dielectric tolerance and loss;
2) Excellent dimensional stability.
3) Low thermal coefficient of dielectric constant;
4) Low Z-Axis expansion;
5) Low in-plane expansion coefficient;
6) Stable electrical properties verus frequency;







1) Attenuator, Automatic gate induction;
2) LNB's for direct broadcost satellites;
3) Microstrip antenna,spread spectrum;
4) Microstrip and cellular base statioin antennas and power amplifers;
5) RF identifications tags
6) Spread spectrum communications systems
7) Trunk amplifier, splitter module etc.




RO4350B & RO4003C Data Sheets

Property Typical Value Direction Units Condition Test Method
  RO4003C RO4350B        

Dielectric Constant,

εr Process

3.38±0.05 3.48±0.05 Z - 10 GHz/23℃ IPC-TM-650 Clampled Stripline

Dielectric Constant,

εr Design

3.55 3.66 Z - 8 to 40 GHz Differntial Phase Length Method
Dissipation Factor Tan, δ 0.0027 0.0021 0.0037 0.0031 Z - 10 GHz/23℃ 2.5 GHz/23℃ IPC-TM-650

Thermal Coefficient

of εr

40 50 Z ppm/℃ minus 50℃ to 150℃ IPC-TM-650
Volume Resistivity 1.7 x 10¹º 1.2 x 10¹º   MΩ·CM COND A IPC-TM-650
Surface Resistivity 4.2 x 10^9 5.7 x 10^9   COND A IPC-TM-650
Electrical Strenghth 31.8 (780) 31.2 (780) Z KV/mm (V/mil) 0.51mm (0.020") IPC-TM-650
Tensile Modulus 19650(2850) 19450(2821) 16767 (2432) 14153 (2053) X Y Mpa(ksi) RT ASTM D638
Tensile Strength 139(20.2) 100(14.5) 203(29.5) 130(18.9) X Y Mpa(ksi) RT ASTM D638
Flexural Strength 276 (40) 255 (37)   Mpa(kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.3 <0.5 X,Y mm/m (mils/inch) after etch E2/150℃ IPC-TM-650 2.4.39A

Coefficient of

Thermal Expansion

11 14 46 10 12 32 X Y Z ppm/℃ minus 55℃ to 288℃ IPC-TM-650 2.4.41
Tg >280 >280   ℃ TMA A IPC-TM-650 2.4.24
Td 425 390   ℃ TGA   ASTM D3850
Thermal Conducvitity 0.71 0.69   W/m/ºk 80℃ ASTM C518
Moisture Absorption 0.06 0.06   % 48 hrs immersion 0.060" sample Temperature 50℃ ASTM D570
Density 1.79 1.86   gm/cm³ 23℃ ASTM D792
Copper Peel Strength 1.05 (6.0) 0.88 (5.0)   N/mm (pli) after solder float 1 oz. EDC Foil IPC-TM-650 2.4.8
Flammability N/A V-0       UL 94
Lead-Free Process Compatible Yes Yes        




The Variety of PCBs

RO4350B PCB Built On 4 Layer With Immersion Gold and Black Silkscreen

RO4350B PCB Built On 4 Layer With Immersion Gold and Black Silkscreen

Contact Details

Contact Person: Ms. Bonnie Shi

Tel: 86-755-27374946

Fax: 86-755-27374947

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