BICHENG ENTERPRISE LIMITED

Specialized in heavy copper PCBs for 15 years

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Home SamplesVia In Pad PCB

12 Layer PCB Built On 2.0mm FR-4 With Via In Pad (VIP) under BGA

Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Seba T.

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me:

—— Daniel F

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Via In Pad PCB

  • High Precision Via In Pad PCB suppliers
  • High Precision Via In Pad PCB suppliers
  • High Precision Via In Pad PCB suppliers
  • High Precision Via In Pad PCB suppliers
  • High Precision Via In Pad PCB suppliers

Via in Pad and BGA

 

With the development of electronic products to light, thin and small, PCBs are also pushed into high density, high difficulty. Among them, via in pad is one of the topics that engineering designer cannot avoid. It is a main part of multilayer PCBs and directly helps to save PCB real estate up to 50% for fine pitch BGA and flip chip components. The main difficulty for VIP is the via-plug process, i.e. how to prevent soldering tin from into via or solder mask onto pads.

 

Solutions

Via in pad holes circuit board technology will solve the high-density packaging laminated holes processing.

 

Applications

1) Through hole, BGA package on multilayer PCBs -->via on ball -->resin via plug -->ground surface -->copper electroplated on plugged via.

2) Blind via, a technique similar to a through hole, with a controlled depth of 0.075mm for the blind hole.

3) HDI multi-step stacking holes technology. The interconnected processing technology is very complex. Multiple holes filling and multiple copper pressing are used to complete the manufacturing process. Such structure in medical, communication products are widely recommended for application.

                                                                                                    

 

 

 

 

 

 

 

 

 

 


PCB services
 1) Base material:FR-4 TG>135, High TG 170, High CTI 600V
 2) Material Brand:ITEQ, SHENGYI
 3) Multilayer lamintion:In house
 4) Solder mask:Green, Blue, Yellow, Black, Red and its relative Matt color
 5) Surface finish:HASL Lead free, ENIG, Immersion silver, Immersion tin.
 6) via filling material:non-conductive epoxy resin
 7) via plugged:pad plugged flatly, good for next SMT process
 8) Product services:Prototypes, small volume and large production
 9) Freight services:Door to door, To sea port, To Airport service

Via In Pad PCB Sample Introduction

12 Layer PCB Built On 2.0mm FR-4 With Via In Pad (VIP) under BGA

China 12 Layer PCB Built On 2.0mm FR-4 With Via In Pad (VIP) under BGA Supplier

Large Image :  12 Layer PCB Built On 2.0mm FR-4 With Via In Pad (VIP) under BGA

Product Details:

Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0895-V8.95

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: USD80~90
Packaging Details: Vaccum
Delivery Time: 8-9 working days
Payment Terms: T/T / Paypal
Supply Ability: 45000 pieces per month
Detailed Product Description
Thermal Conductivity: FR-4, ITEQ IT-140, Tg>135℃, Er<5.4 Board Thick: 2.0mm ±10%
Outer Copper Thick: 1 Oz Inner Copper Thick: 1 Oz
Surface Finish: Immersion Gold (ENIG)( 2 µ" Over 100 µ" Nickel) Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied.
Colour Of Component Legend: White, IJR-4000 MW300, Taiyo Supplied. TEST: 100% Electrical Test Prior Shipment

Product profile

 

 

1.1 General description

 

This is a type of multilayer PCB built on FR-4 substrate with Tg 135°C for the application

of Signal transmission with 12 layer copper track. It's 2.0 mm thick with white silkscreen

(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The base material is

from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using

supplied Gerber data. Each 20 boards are packed for shipment.

 

 

1.2 Features and benifits

A. Lead free assemblies with a maximum reflow temperature of 260℃.
B. Long storage time ( It can be stored for more than 1 year in vacuum bag)
C. Improved the speed of signal transmission
D. PCB manufacturing on required specifications.
E. Quick and on-time delivery
F. UL recognized and RoHS Directive-compliant
G. Prototype PCB capability

 


1.3 Application

Dsl Modem, Solar Battery Charger, Vehicle Tracker, GPS Receiver, Wi Fi Antenna,

Bluetooth USB Hub, USB Wireless Router, SMS Modem, Multicoupler Antenna,

Phone systems

 

 

1.4 Parameter and data sheet

PCB SIZE 257 x 171.5mm=1PCS=1design
BOARD TYPE Multilayer PCB
Number of Layers 12 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- TOP 17um(1oz)+plate 25um
130 um prepreg 1080 x 2
copper ------- L02 35um(1oz)
150um core FR-4
copper ------- L03 35um(1oz)
130 um prepreg 1080 x 2
copper ------- L04 35um(1oz)
150um core FR-4
copper ------- L05 35um(1oz)
130 um prepreg 1080 x 2
copper ------- L06 35um(1oz)
150um core FR-4
copper ------- L07 35um(1oz)
130 um prepreg 1080 x 2
copper ------- L08 35um(1oz)
150um core FR-4
copper ------- L09 35um(1oz)
130 um prepreg 1080 x 2
copper ------- L10 35um(1oz)
150um core FR-4
copper ------- L11 35um(1oz)
130 um prepreg 1080 x 2
copper ------- BOT 17um(0.5oz)+plate 25um
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.25 mm / 3.0 mm
Number of Different Holes: 26
Number of Drill Holes: 4013
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL  
Glass Epoxy: FR-4, ITEQ IT-140, Tg>135℃, er<5.4
Final foil external: 1oz
Final foil internal: 1oz
Final height of PCB: 2.0mm ±10%
PLATING AND COATING  
Surface Finish Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel)
Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, PSR-2000GT600D, Taiyo supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:

Marked on the board in a conductor and

leged FREE AREA

VIA

Plated Through Hole(PTH), via tented.

Vin in pad under BGA package

FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

BichengPCB different PCB's

12 Layer PCB Built On 2.0mm FR-4 With Via In Pad (VIP) under BGA

12 Layer PCB Built On 2.0mm FR-4 With Via In Pad (VIP) under BGA

Contact Details
BICHENG ENTERPRISE LIMITED

Contact Person: Ms. Natalie Xue

Tel: 86-755-27374946-27374847

Fax: 86-755-27374947

Send your inquiry directly to us (0 / 3000)