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Home SamplesImpedance Controlled PCB

10 Layer PCB Built On Tg170℃ FR4 With Single-End / Differential Impedance Control

Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Seba T.

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me:

—— Daniel F

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Impedance Controlled PCB

  • High Precision Impedance Controlled PCB suppliers
  • High Precision Impedance Controlled PCB suppliers
  • High Precision Impedance Controlled PCB suppliers
  • High Precision Impedance Controlled PCB suppliers
  • High Precision Impedance Controlled PCB suppliers

General Profile

Without impedance control, significant signal reflections and signal distortions will occur, resulting in design failure. Impedance control is required for common signals, such as PCI bus, PCI-E bus, USB, Ethernet, DDR memory, LVDS signals, etc. Impedance control eventually needs to be achieved by PCB design and a higher requirement for PCB board process is also put forward too. So we need to control the impedance of wiring as per the signal integrity requirement.


Definition of characteristic impedance

At a certain frequency, relative to a reference layer, the resistance of its high-frequency signals or electromagnetic waves in the process of transmission is called the characteristic impedance, which is the vector summation of electrical impedance, inductive reactance, capacitance resistance.


Basic elements that affect impedance

1) Thickness of trace (T1) 7%

2) Width of trace (W1) 4%

3) Height of laminate (H1) 35%

4) Dielectric constant of board material (Er1) 8%

5) Other factors can be involved, however they have much less affect on the impedance such solder resist, thickness of tin and lead, PCB humidity etc


Main factors affected impedance control (normally ±10%)

1) Generally, designed width of trace is already fixed, manufacturing procedure is controlled within ±15-20%

2) Generally, the thickness of trace is already fixed at designing period, manufacturing procedure of electroplate is controlled within ±0.8-1.2mil

3) The dielectric constant of the substrate is almost fixed, no much big changes.

4) The above-mentioned factors can be controlled stably, the main affecting factor of impedance control is only left height of laminate.


Main factors to the height of laminate

1) Thickness of inner layer copper

2) Residual rate of inner layer copper

3) Use which kind of prepreg


The classification of characteristic impedance

Common characteristic impedance is divided into: single ended (line) impedance, differential impedance, coplanar impedance, etc.


Single ended impedance: refers to the measured impedance of a single signal line.

Differential impedance: refers to the impedance measured between the two transmission lines with equivalent width and spacing in differential drive.


Coplanar impedance: refers to the impedance measured when the signal line is transmitting between its surrounding GND / VCC (the space between the signal line to GND / VCC on both sides is equal).


Testing the PCB

PCB testing is normally done on one test coupon integrated into the PCB panel, not on the PCB itself. Coupons are designed for specific time domain reflectometer.




Impedance Controlled PCB Sample Introduction

10 Layer PCB Built On Tg170℃ FR4 With Single-End / Differential Impedance Control

China 10 Layer PCB Built On Tg170℃ FR4 With Single-End / Differential Impedance Control Supplier

Large Image :  10 Layer PCB Built On Tg170℃ FR4 With Single-End / Differential Impedance Control

Product Details:

Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0894-V8.94

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: USD80~90
Packaging Details: Vaccum
Delivery Time: 8-9 working days
Payment Terms: T/T / Paypal
Supply Ability: 45000 pieces per month
Detailed Product Description
Thermal Conductivity: FR-4 TG170℃, Er<5.4.IT-180, ITEQ Supplied Board Thick: 1.6mm ±0.16
Outer Copper Thick: 1 Oz Inner Copper Thick: 1 Oz
Surface Finish: Immersion Gold (30.1% ) 0.1µm Over 3µm Nickel Solder Mask Color: Green, PSR-2000 KX700G, Taiyo Supplied.
Colour Of Component Legend: White, S-380W, Taiyo Supplied. TEST: 100% Electrical Test Prior Shipment

Product profile



1.1 General description

This is a type of multilayer PCB built on FR-4 substrate with Tg 170°C for the application

of Satellite systems with 10 layer copper. It's 1.6 mm thick with white silkscreen(Taiyo) on

green solder mask (Taiyo) and immersion gold on pads. This is also an impedance

controlled PCB with 50 ohm single-end impedance and 97 ohm with differential impedance

control. The base material is from ITEQ supplying 4 up PCBs per panel. They're fabricated

per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.



1.2 Features and benifits

A. Lead free assemblies with a maximum reflow temperature of 260℃
B. SMT process is resistant to reflow soldering, resistant to rework.
C. The signal lines form a constant low impedance to the ground
D. Strict WIP inspection and monitoring as well as working instruction
E. UL, ISO14001, TS16949 certified
F. Hassle-free, one-to-one after-sales service
G. Delivery on time: >98%


1.3 Application

Preamplifier, Satellite Dish, GPS Tracking Devices, SAN Storage, AC Drives,

GSM Signal Booster, Mobile Broadband Router, Inverter 220V, Memory Module,

Automotive dashboards



1.4 Parameter and data sheet

PCB SIZE 199 x 170mm=4PCS
Number of Layers 10 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
Prepreg 0.1016mm (4mil)
copper ------- 35um(1oz) Plane GND
FR-4 0.127mm (5 mil)
copper ------- 18um(0.5 oz) Signal SIG1
Prepreg 0.127 mm (5mil)
copper ------- 18um(0.5 oz) Signal SIG2
Prepreg 0.127mm (5 mil)
copper ------- 35um(1oz) Plane PWR
FR-4 0.330mm (13mil)
copper ------- 35um(1oz) Plane GND
Prepreg 0.127mm (5 mil)
copper ------- 18 um(0.5 oz) Signal SIG3
Prepreg 0.127mm (5 mil)
copper ------- 18 um(0.5 oz) Signal SIG4
Prepreg 0.127mm (5 mil)
copper ------- 35um(1oz) Plane GND
Prepreg 0.1016mm (4mil)
copper ------- 35um(1oz) Signal BOT
Minimum Trace and Space: 4mil/4mil
Minimum / Maximum Holes: 0.25/4.2mm
Number of Different Holes: 15
Number of Drill Holes: 850
Number of Milled Slots: 10
Number of Internal Cutouts: 0
Impedance Control:

YES. Top layer, 7.0 mil trace 50 ohms single end.

Layer 3 signal layer, 4.0/4.0 mil trace-space differential impedance = 91 ohms; 4.0/6.0 mil trace-space differential impedance = 97 ohms.

Number of Gold finger: 0
Glass Epoxy: FR-4 TG170℃, er<5.4.IT-180, ITEQ Supplied
Final foil external: 1oz
Final foil internal: 1oz
Final height of PCB: 1.6mm ±0.16
Surface Finish Immersion gold (30.1% ) 0.1µm over 3µm nickel
Solder Mask Apply To: TOP and Bottom, 12micron Minimum
Solder Mask Color: Green, PSR-2000 KX700G, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, stamp holes.
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA plated through hole(PTH), minimum via 10 mils.
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


10 Layer PCB Built On Tg170℃ FR4 With Single-End / Differential Impedance Control

10 Layer PCB Built On Tg170℃ FR4 With Single-End / Differential Impedance Control

Contact Details

Contact Person: Ms. Natalie Xue

Tel: 86-755-27374946-27374847

Fax: 86-755-27374947

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