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10 Layer Multilayer PCB Built On FR-4 green soldermask With Immersion Gold

Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Seba T.

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me:

—— Daniel F

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Multilayer PCB

  • High Precision Multilayer PCB suppliers
  • High Precision Multilayer PCB suppliers
  • High Precision Multilayer PCB suppliers
  • High Precision Multilayer PCB suppliers
  • High Precision Multilayer PCB suppliers

General Profile

Multilayer PCB's represent one of the most complicated products in the PCB industry. A breakdown of a multilayer PCB shows that it consists of three basic elements: thin rigid laminates, prepreg sheet for bonding the laminates and copper foils.

 

Purpose of Multilayer PCBs

1) To accommodate a larger number of interconnections that steadily increasing use of high pin-count integrated circuits(IC).

 

2) To establish an electrical performance of the multilayer PCB, such as voltage and ground planes, EMC-shielding and circuit speed etc.

 

Layer Stackup

The purpose of stackup is to interleave the thin laminates and the prepreg sheets in correct sequence and ensure correct layer-to-layer registration. The stackup of multilayer boards can be done in many different ways.

 

The process of multilayer PCB

1) In general, a multilayer board consists of a number of very thin print-and-etch inner layers, but drilling of holes has not been carried out. Outer layers of the multilayer board remain unetched.

 

2) Layers from top to bottom are bonded together in close registration by means of thin plies of prepreg. The bonding is performed under close temperature and pressure control in a lamination press.

 

3) After lamination, they are the processed in very much the same way as an ordinary double-sided PTH boards, i.e. holes are drilled, cleaned and plated. Outer layers are etched to develop the circuit pattern. Solder masks are applied and solder coating (HAS, ENIG etc) is performed.

 

Thin laminate (base masterial FR-4)

Vendor Model Thickness Copper TG ER
SHENGYI S1141 0.05-3.2 mm 17-105 μm ≥130 ≤5.4
SHENGYI S1170 0.05-3.2 mm 17-105 μm ≥170 ≤5.4
ITEQ IT-140 0.05-1.5 mm 17-175 μm >135 <5.4
ITEQ IT-180 0.05-1.5 mm 17-175 μm >170 <5.4
ITEQ IT-180A 0.05-1.5 mm 17-175 μm >170 <5.4

 

Comparison of different Prepreg.

Type of Prepreg Finished Thickness Resin Content
  mm mil %
7628H(7630) 0.213 8.4 50
7628(43%) 0.195 7.6 43
7628(41%) 0.185 7.3 41
2116HR 0.135 5.3 57
2116 0.120 4.7 52
2113 0.100 4.0 56
1080 0.076 3.0 64
1060 0.050 2.0 71

 

 

Multilayer PCB Sample Introduction

10 Layer Multilayer PCB Built On FR-4 green soldermask With Immersion Gold

China 10 Layer Multilayer PCB Built On FR-4 green soldermask With Immersion Gold Supplier

Large Image :  10 Layer Multilayer PCB Built On FR-4 green soldermask With Immersion Gold

Product Details:

Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0858-V8.58

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: USD80~90
Packaging Details: Vaccum
Delivery Time: 7-8 working days
Payment Terms: T/T / Paypal
Supply Ability: 45000 pieces per month
Detailed Product Description
Glass Epoxy: FR-4, SHENGYI TG ≧170 Board Thick: 2.0+/-10% Mm
Outer Copper Thick: 1 Oz Inner Copper Thick: 1 Oz
Surface Finish: ENIG, Nickel 100u'',Gold ≧2u'' Solder Mask Color: Green
Colour Of Component Legend: White TEST: 100% Electrical Test Prior Shipment

Product profile

 

1.1 General description


This is a type of 10 layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from Shengyi and supplying 1 up board. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.

 

1.2 Features and benifits

A. Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.
B. Excellent wetting during component soldering and it can avoid copper corrosion.
C. Engineering design prevents problems from occurring in pre production.
D. Right manufacturing instruction (MI)
E. UL recognized and RoHS Directive-compliant
F. Customer complaint rate: <1%

 

1.3 Application

Converter, USB Wireless Adapter, 12V Inverter, Wireless Router Reviews, Ladder

Logic, Battery Inverter, CCTV Security, Wireless G Router, Programmable Controllers,

Backplanes

 

1.4 Parameter and data sheet

Item Description Contect
Layer count 10 layer PCB 10 layer board
Board type Multilayer pcb Multilayer pcb board
Board size 168.38 x 273.34mm=1up 168.38 x 273.34mm=1up
Laminate Laminate Type FR4
Supplier SHENGYI
Tg TG ≧170
Finished thickness 2.0+/-10% MM
Plating Thickness PTH Cu thickness >20 um
Inner layer Cu Thickness 1/1 OZ
Surface Cu thickness 35 um
Solder Mask Material type LP-4G G-05
Supplier Nan Ya
Color Green
Single / both sides Both Sides
S/M thickness >=10.0 um
3M tape test NO Peel Off
Legend Material type S-380W
Supplier Tai yo
Color White
Location Both Sides
3M tape test No peel off
Circuit Trace Width (mm) 0.203+/-20%mm
Spacing (mm) 0.203+/- 20%mm
Identification UL mark 94V-0
Company Logo QM2
Date code 1017
Mark location CS
Surface Treatment ENIG Nickel 100u''
Gold ≧2u''
Reliabilty Tests Thermal shock test 288±5℃, 10sec ,3 cycles
solder abllity test 245±5℃
Function Electrioal Test 233+/-5℃
Standard IPC-A 600H class 2, IPC_6012C CLASS 2   100%
Appearance Visual inspection 100%
warp and twist <= 0.75%
Others V-Cut thickness 0.4±0.1 mm
Angle 30+/- 5
Drill table (mm) No PTH/NPTH Size
1 Y 0.500*1.00+/-0.075
2 Y 0.508+/-0.075
3 Y 0.610+/-0.075
4 N 0.700+/-0.075
5 Y 0.711+/-0.075
6 Y 0.914+/-0.075
7 N 1.118+/-0.075
8 N 1.219+/-0.075
9 N 1.524+/-0.075
10 N 1.600+/-0.075
11 Y 2.540+/-0.075
12 Y 2.997+/-0.075
13 N 3.500+/-0.075

 

10 Layer Multilayer PCB Built On FR-4 green soldermask With Immersion Gold

10 Layer Multilayer PCB Built On FR-4 green soldermask With Immersion Gold

Contact Details
BICHENG ENTERPRISE LIMITED

Contact Person: Ms. Natalie Xue

Tel: 86-755-27374946-27374847

Fax: 86-755-27374947

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