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Home SamplesMultilayer PCB

Blind via Cell PCB 4 layers Built On FR-4 With Immersion Gold 48up Panel

Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Seba T.

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me:

—— Daniel F

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Multilayer PCB

  • High Precision Multilayer PCB suppliers
  • High Precision Multilayer PCB suppliers
  • High Precision Multilayer PCB suppliers
  • High Precision Multilayer PCB suppliers
  • High Precision Multilayer PCB suppliers

General Profile

Multilayer PCB's represent one of the most complicated products in the PCB industry. A breakdown of a multilayer PCB shows that it consists of three basic elements: thin rigid laminates, prepreg sheet for bonding the laminates and copper foils.

 

Purpose of Multilayer PCBs

1) To accommodate a larger number of interconnections that steadily increasing use of high pin-count integrated circuits(IC).

 

2) To establish an electrical performance of the multilayer PCB, such as voltage and ground planes, EMC-shielding and circuit speed etc.

 

Layer Stackup

The purpose of stackup is to interleave the thin laminates and the prepreg sheets in correct sequence and ensure correct layer-to-layer registration. The stackup of multilayer boards can be done in many different ways.

 

The process of multilayer PCB

1) In general, a multilayer board consists of a number of very thin print-and-etch inner layers, but drilling of holes has not been carried out. Outer layers of the multilayer board remain unetched.

 

2) Layers from top to bottom are bonded together in close registration by means of thin plies of prepreg. The bonding is performed under close temperature and pressure control in a lamination press.

 

3) After lamination, they are the processed in very much the same way as an ordinary double-sided PTH boards, i.e. holes are drilled, cleaned and plated. Outer layers are etched to develop the circuit pattern. Solder masks are applied and solder coating (HAS, ENIG etc) is performed.

 

Thin laminate (base masterial FR-4)

Vendor Model Thickness Copper TG ER
SHENGYI S1141 0.05-3.2 mm 17-105 μm ≥130 ≤5.4
SHENGYI S1170 0.05-3.2 mm 17-105 μm ≥170 ≤5.4
ITEQ IT-140 0.05-1.5 mm 17-175 μm >135 <5.4
ITEQ IT-180 0.05-1.5 mm 17-175 μm >170 <5.4
ITEQ IT-180A 0.05-1.5 mm 17-175 μm >170 <5.4

 

Comparison of different Prepreg.

Type of Prepreg Finished Thickness Resin Content
  mm mil %
7628H(7630) 0.213 8.4 50
7628(43%) 0.195 7.6 43
7628(41%) 0.185 7.3 41
2116HR 0.135 5.3 57
2116 0.120 4.7 52
2113 0.100 4.0 56
1080 0.076 3.0 64
1060 0.050 2.0 71

 

 

Multilayer PCB Sample Introduction

Blind via Cell PCB 4 layers Built On FR-4 With Immersion Gold 48up Panel

China Blind via Cell PCB 4 layers Built On FR-4 With Immersion Gold 48up Panel Supplier

Large Image :  Blind via Cell PCB 4 layers Built On FR-4 With Immersion Gold 48up Panel

Product Details:

Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0842-V8.42

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: USD40~50
Packaging Details: Vaccum
Delivery Time: 6-7 working days
Payment Terms: T/T / Paypal
Supply Ability: 45000 pieces per month
Detailed Product Description
Glass Epoxy: FR-4, ITEQ IT-180 TG>170°C, Er<5.4 Board Thick: 1.6mm ±0.16
Outer Copper Thick: 1 Oz Inner Copper Thick: 0.5 Oz
Surface Finish: Immersion Gold (31.3%) 2 Micoinch Over 100 Microinch Nickel Solder Mask Color: Green
Colour Of Component Legend: White TEST: 100% Electrical Test Prior Shipment

Product profile

 

1.1 General description


This is a type of 4 layer printed circuit board built on FR-4 substrate with Tg 170°C

for the application of Microcontroller. It's 1.6 mm thick with white silkscreen(Taiyo)

on green solder mask (Nanya) and immersion gold on pads. The base material is

from Taiwan ITEQ supplying 48 up PCB per panel. They're fabricated per IPC 6012

Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.

 

1.2 Features and benifits

A. Lead-Free Assembly Compatible
B. Long storage time (It can be stored for more than 1 year in vacuum bag)
C. Impedance control test and solder-ability test
D. Quick CADCAM checking and free PCB quotation
E. Quick Lead time: 3-5 days
F. Free stencil shim sent for new user


1.3 Application

GPRS, VHF Radio, Car Tracking Device, Communication Systems, Electric Converter,

Inverter Solar, PLC Ladder Logic, HSDPA USB Modem, 3G Wireless Modem, Automobile


1.4 Parameter and data sheet

PCB SIZE 230 x 209mm=48PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17.8um(0.5oz)+plate TOP layer
Prepreg 7628(43%) 0.195mm
copper ------- 18um(0.5oz) MidLayer 1
FR-4 1.0mm
copper ------- 18um(0.5oz) MidLayer 2
Prepreg 7628(43%) 0.195mm
copper ------- 17.8um(0.5oz)+plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 6.7mil/5.9mil
Minimum / Maximum Holes: 0.3/2.5mm
Number of Different Holes: 13
Number of Drill Holes: 2512
Number of Milled Slots: 144
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL  
Glass Epoxy: FR-4, ITEQ IT-180 TG>170°C, er<5.4
Final foil external: 1oz
Final foil internal: 0.5oz
Final height of PCB: 1.6mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold (31.3%) 2 micoinch over 100 microinch nickel
Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, LP-4G G-05, Nanya supplied
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented. Blind via from to inner layer 1
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Blind via Cell PCB 4 layers Built On FR-4 With Immersion Gold 48up Panel

Contact Details
BICHENG ENTERPRISE LIMITED

Contact Person: Ms. Natalie Xue

Tel: 86-755-27374946-27374847

Fax: 86-755-27374947

Send your inquiry directly to us (0 / 3000)