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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communication

Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communication

  • Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communication
  • Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communication
Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communication
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-0036-V0.73
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-9.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Number Of Layers: 2 Glass Epoxy: TLY-3
Final Foil: 1.0 Oz Final Height Of PCB: 0.8 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: No
Colour Of Component Legend: NO Test: 100% Electrical Test Prior Shipment

Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Taconic TLY laminates are a type of low loss laminates. They are manufactured with very lightweight woven fiberglass and are more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.

 

The dielectric constant is as low as 2.17-2.20 +/-0.02, and dissipation factor is as low as 0.0009.

 

Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communication 0

 

Benefits:

Dimensionally stable

Lowest DF

Low moisture absorption

High copper peel strength

Uniform & consistent DK

Laser ablatable

 

Applications:

Automotive radar

Satellite/cellular communications

Power amplifiers

LNBs, LNAs, LNCs

Aerospace

Ka, E and W band applications

 

 

PCB Specifications

PCB SIZE 100 x 90mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
TLY-3 0.762mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.4mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: TLY-3 0.762mm
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1
PLATING AND COATING  
Surface Finish Immersion gold (31%)
Solder Mask Apply To: NO
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend Top Side
Colour of Component Legend white
Manufacturer Name or Logo: Marked on the board in a conductor and legend FREE AREA
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

Data Sheet of Taconic TLY Material

TLY TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650 2.5.5.5   2.2   2.2
Df at 10 GHz IPC-650 2.5.5.5   0.0009   0.0009
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19   0.21   0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038   -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031   -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260) ASTM D 3386(TMA) ppm/ 26 ppm/ 26
CTE(Y axis)(25-260) ASTM D 3386(TMA) ppm/ 15 ppm/ 15
CTE(Z axis)(25-260) ASTM D 3386(TMA) ppm/ 217 ppm/ 217
NASA Outgassing(% TML)     0.01   0.01
NASA Outgassing(% CVCM)     0.01   0.01
NASA Outgassing(% WVR)     0.00   0.00
UL-94 Flammability Rating UL-94   V-0   V-0
 
Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communication 1

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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