F4BTM450 PCB 2-layer 3.2mm Thick with ENIG, Immersion Silver, Immersion Tin, HASL

F4BTM: Exploring an Advanced High-Frequency Circuit Laminate

Introduction:
Introducing F4BTM, a remarkable series of high-frequency circuit laminates designed to deliver exceptional performance across a wide range of applications. Crafted with precision, F4BTM blends glass fiber cloth, nano-ceramic filling, and polytetrafluoroethylene (PTFE) resin to achieve outstanding electrical and thermal properties. In this article, we delve into the key features, construction details, statistics, and typical applications of F4BTM, shedding light on its suitability for advanced electronic designs.

Unveiling F4BTM:
The F4BTM series builds upon the F4BM dielectric layer and incorporates cutting-edge high-dielectric and low-loss nanoscale ceramics. By combining these materials, F4BTM achieves a higher dielectric constant, improved heat resistance, reduced coefficient of thermal expansion, enhanced insulation resistance, and better thermal conductivity. These advancements are seamlessly blended with low-loss characteristics, positioning F4BTM as the go-to choice for high-frequency applications.

Key Features of F4BTM450:

• F4BTM450 boasts a dielectric constant (Dk) of 4.5 at 10GHz, enabling efficient signal propagation within high-frequency circuits.
• With a dissipation factor of 0.002 at 10GHz, F4BTM450 ensures minimal signal loss and upholds high signal integrity.
• F4BTM450 exhibits a coefficient of thermal expansion (CTE) of 10 ppm/°C (x-axis), 12 ppm/°C (y-axis), and 51 ppm/°C (z-axis) within the temperature range of -55°C to 288°C. This exceptional dimensional stability remains intact even under varying thermal conditions.
• Across the temperature range of -55°C to 150°C, F4BTM450 maintains a low thermal coefficient of Dk at -60 ppm/°C, ensuring consistent electrical performance in diverse temperature environments.
• With a moisture absorption rate of 0.05%, F4BTM450 enhances long-term reliability, bolstering its suitability for demanding applications.

PCB Stackup and Construction Details:

• The F4BTM450 design employs a 2-layer rigid PCB configuration.
• The stackup comprises copper_layer_1 (35 μm), F4BTM450 core (3.05 mm or 120 mils), and copper_layer_2 (35 μm).
• The board dimensions are set at 63mm x 63mm (+/- 0.15mm), offering a compact form factor.
• Precise routing is facilitated by the minimum trace/space requirements of 6/8 mils.
• Efficient component placement and assembly are made possible by the minimum hole size of 0.4mm.
• The finished board thickness of 3.1mm ensures durability and stability.
• F4BTM450 supports a finished copper weight of 1oz (1.4 mils) on outer layers, ensuring robust electrical connections.
• Reliable interconnectivity is guaranteed with a via plating thickness of 20 μm.
• An immersion gold surface finish is applied, providing excellent solderability and corrosion resistance.
• The top silkscreen is white, offering clear component identification.
• The bottom silkscreen is intentionally excluded, allowing flexibility for customization.
• Each board undergoes 100% electrical testing before shipment, ensuring optimal performance and reliability.

PCB Statistics:

• The design incorporates 31 components.
• A total of 59 pads are utilized.
• Thru-hole pads account for 32 of the total.
• The design includes 27 top SMT pads.
• No bottom SMT pads are present.
• The design incorporates 28 vias.
• A total of 3 nets are utilized.

Artwork and Quality Standard:
F4BTM utilizes the Gerber RS-274-X artwork format, ensuring seamless compatibility with industry-standard PCB design tools.
The manufacturing and assembly of F4BTM adhere to the high-quality IPC-Class-2 standard, guaranteeing exceptional quality throughout the production process.

Worldwide Availability:
F4BTM laminates are readily available worldwide, enabling designers and manufacturers across the globe to access this cutting-edge technology.

Typical Applications:

• Aerospace Equipment: F4BTM finds extensive applications in aerospace equipment, delivering reliable performance in space and cabin systems.
• Microwave and RF Systems: F4BTM is exceptionally well-suited for microwave and RF systems, ensuring efficient signal transmission and reception.
• Radar Systems: F4BTM is a preferred choice for military radar systems, offering exceptional performance in demanding environments.
• Feed Networks: F4BTM supports various applications requiring reliable signal distribution through efficient feed networks.
• Phase-Sensitive Antennas: F4BTM is the optimal solution for phase-sensitive antennas and phased array antennas, enabling precise and efficient signal control.
• Satellite Communications: F4BTM enhances the performance of satellite communication systems, ensuring reliable signal transmission over long distances.

In conclusion, F4BTM stands as a remarkable high-frequency circuit laminate, offering exceptional electrical and thermal properties. Its advanced composition and construction make it a preferred choice for a wide array of applications, ranging from aerospace equipment to radar systems and satellite communications. With its worldwide availability and commitment to high-quality standards, F4BTM empowers designers and manufacturers to achieve optimal performance and reliability in their advanced electronic designs.