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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors

Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors

  • Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors
  • Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors
  • Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors
  • Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors
  • Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors
Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise
Certification: UL
Model Number: BIC-0254-V2.54
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-5.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 5-6 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 1 Glass Epoxy: Polyimide (PI) 25um
Final Foil: 1 Oz Final Height Of PCB: 0.1 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: Yellow
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors

(FPC’s are custom-made products, the picture and parameters shown are just for reference)

 

 

General description

This is a type of flexible printed circuit for the application of antenna. It’s a single layer board at 0.10mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. 3M tape is applied on the back side.

 

Parameter and data sheet

Number of Layers 1
Board Type Flexbile cirucit
Board Thickness 0.1mm +/-10%
Board Material Polyimide (PI) 25um
Board Material Supplier ITEQ
Tg Value of Board Material 60℃
 
PTH Cu thickness N/A
Inner Iayer Cu thicknes N/A
Surface Cu thickness 35 um (1oz)
 
Coverlay Colour Yellow
Number of Coverlay 1
Thickness of Coverlay 25 um
Stiffener 200 um
3M Tape Yes
 
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 2
 
Mininum Trace (mil) N/A
Minimum Gap(mil) N/A
 
Surface Finish Immersion Gold
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles.
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors 0

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Controllability of electrical parameter design

The end can be whole soldered

Material optionality

Accept small quantity, prototypes and mass production.

Quick Lead time: 3-5 days

 

Applications

Capacitive touch screen / panel, flex keyboard for mobile phone keys, LED display soft board

 

Copper foil is available in two different types of copper: ED Copper and RA copper.

ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

Copper foil is available in thickness of 12, 18, 35 and 70 μm.

 

The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:

High temperature resistance allows soldering operations without damaging the flexible circuits

Very good electrical properties

Good chemical resistance

Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.

 

Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.

 


Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors 1

 

Single Layer Flexible Circuits On Polyimide With 3M Tape and Immersion Gold for Antenna Sensors 2

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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