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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System

Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System

  • Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System
  • Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System
  • Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System
  • Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System
  • Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System
Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0276-V2.76
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-6.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide 25µm Board Thickness: 0.15 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 2

Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System

(FPC’s are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of flexible printed circuit for the application of Monitoring Systems. It’s a single layer FPC at 0.15mm thick. FR-4 as stiffener is used on the bottom side. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.

 

Parameter and data sheet

Size of Flexible PCB 55.11 X 42.31mm
Number of Layers 1
Board Type Flex PCB
Board Thickness 0.15mm
Board Material Polyimide 25µm
Board Material Supplier ITEQ
Tg Value of Board Material 60℃
 
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes N/A
Surface Cu thickness 35 µm
   
Coverlay Colour Yellow
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material FR-4 stiffner
Stiffener Thickness 1.0mm
   
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃ No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles.
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System 0

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

The end can be whole soldered

Low cost

Continuity of processing

Quick and on-time delivery

Eligible products rate of first production: >95%

 

Applications

Toy lamp strip, FFC for industrial control equipment, Tablet PC capacitive screen soft board

 

Components of a flexible circuit

A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.

Copper foil is available in two different types of copper: ED Copper and RA copper.

 

ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

Copper foil is available in thickness of 12, 18, 35 and 70 μm.

 

The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:

High temperature resistance allows soldering operations without damaging the flexible circuits

Very good electrical properties

Good chemical resistance

Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.

 

Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.


Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System 1

Single Layer Flexible Circuit with 1.0mm FR-4 Stiffener and Immersion Gold for Monitoring System 2

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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