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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners.

Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners.

  • Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners.
  • Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners.
  • Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners.
  • Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners.
Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners.
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-138-V0.27
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-8.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Glass Epoxy: TC350
Final Foil: 1 Oz Final Height Of PCB: 0.3mm ±10%
Surface Finish: Immersion Gold 0.025µm Over 3µm Nickel Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers' TC350 is a woven fiberglass reinforced, ceramic filled, PTFE based composite for use as making printed circuit board.TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

 

Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners. 0

 

Features & Benefits:

1. The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. This results in reduced junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs.

 

2. TC350 has excellent Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes.

 

3. TC350 enjoys a strong bond to copper, utilizing microwave grade, low profile copper. This results in even lower insertion loss due to skin effect losses of copper that are more obvious at higher RF and microwave frequencies.

 

 

Our PCB Capabilities (TC350)

PCB Material: Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite
Designation: TC350
Dielectric constant: 3.5±0.05
Thermal Conductivity 0.72 W/m-K
Dissipation Factor Df .002@10 GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

 

Typical Applications:

1. Microwave Combiner and Power Dividers

2. Power Amplifiers, Filters and Couplers

3. Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)

4. Thermally Cycled Antennas sensitive to dielectric drift

 

Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners. 1

 

Typical Properties of TC350:

Property Units Value Test Merthod
1. Electrical Properties  
Dielectric Constant (may vary by thickness)      
@1 MHz 3.50 IPC TM-650 2.5.5.3
@1.8 GHz 3.50 RESONANT CAVITY
@10 GHz 3.50 IPC TM-650 2.5.5.5
Dissipation Factor      
@1 MHz 0.0015 IPC TM-650 2.5.5.3
@1.8 GHz 0.0018 RESONANT CAVITY
@10 GHz 0.0020 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric    
TC r @ 10 GHz (-40-150°C) ppm/ºC -9 IPC TM-650 2.5.5.5
Volume Resistivity      
C96/35/90 MΩ-cm 7.4x106 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 1.4x108  
Surface Resistivity      
C96/35/90 3.2x107 IPC TM-650 2.5.17.1
E24/125 4.3x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 780 (31) IPC TM-650 2.5.6.2
Dielectric Breakdown kV 40 IPC TM-650 2.5.6
Arc Resistance sec >240 IPC TM-650 2.5.1
2.Thermal Properties  
Decomposition Temperature (Td)      
Initial °C 520 IPC TM-650 2.4.24.6
5% °C 567 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 7, 7 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 12 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % 1.2 IPC TM-650 2.4.24
3. Mechanical Properties  
Peel Strength to Copper (1 oz/35 micron)      
After Thermal Stress lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
At Elevated Temperatures (150ºC) lb/in (N/mm) 9 (1.6) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa)   IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 14/10 (97/69) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 11/8 (76/55) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (MPa)   ASTM D-3410
Poisson’s Ratio   ASTM D-3039
4. Physical Properties  
Water Absorption % 0.05 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 2.30 ASTM D792 Method A
Thermal Conductivity W/mK 0.72 ASTM D5470
Specific Heat J/gK 0.90 ASTM D5470
Flammability class V0 UL-94
NASA Outgassing, 125ºC, ≤10- 6 torr      
Total Mass Loss % 0.02 NASA SP-R-0022A
Collected Volatiles % 0.01 NASA SP-R-0022A
Water Vapor Recovered % 0.01 NASA SP-R-0022A

 

Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners. 2
 
Rogers TC350 Double Sided High Frequency PCB Built On 10mil Core With Immersion Gold for Microwave Combiners. 3

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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