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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin

  • Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin
  • Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin
  • Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin
Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-187-V6
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T
Supply Ability: 50000 pieces per month
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Detailed Product Description
Glass Epoxy: RO4534 Final Height Of PCB: 1.6 Mm ±0.1mm
Final Foil External: 1oz Surface Finish: ENIG
Solder Mask Color: Green Colour Of Component Legend: White
Number Of Layers: 2 Layers

RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil RO4534 Antenna PCB With Immersion Gold, Silver and Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

RO4534 High Frequency Laminates are ceramic-filled, glass-reinforced hydrocarbon based material which are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.4 and a loss tangent (Df) of 0.0027 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

 

It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4534 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.

 

Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin 0

 

Features and Benefits

1. Low Loss 0.0027 , Low Dk 3.4, low PIM response: Wide range of application use

2. Thermoset resin system: Compatible with standard PCB fabrication

3. Excellent dimensional stability: Greater yield on larger panels sizes

4. Uniform mechanical properties: Maintains mechanical form during handling

5. High thermal conductivity: Improved power handling

 

Typical Applications:

1. Cellular infrastructure base station antennas

2. WiMAX antenna networks

 

Our PCB Capability (RO4534)

PCB Material: Ceramic-filled, Glass-reinforced Hydrocarbon
Designation: RO4534
Dielectric constant: 3.4
Dissipation Factor 0.0027 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

RO4534 Typical Values

Property RO4534 Direction Units Condition Test Method
Dielectric Constant, er Process 3.4 ± 0.08 Z - 10 GHz/23 2.5 GHz IPC-TM-650,2.5.5.5
Dissipation Factor 0.0022 Z - 2.5 GHz/23 IPC-TM-650, 2.5.5.5
0.0027 10 GHz/23
PIM (Typical) -157 - dBc Reflected 43 dBm swept tones Summitek 1900b PIM Analyzer
Dielectric Strength >500 Z V/mil 0.51 mm IPC-TM-650, 2.5.6.2
Dimensional Stability <0.3 X,Y mm/m (mils/inch) after etch IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion 11 X ppm/ -55 to 288 IPC-TM-650, 2.4.41
14 Y
46 Z
Thermal Conductivity 0.6 - W/(m.K) 80 ASTM C518
Moisture Absorption 0.06 - % D48/50 IPC-TM-650, 2.6.2.1 ASTM D570
Tg >280 - TMA A IPC-TM-650, 2.4.24.3
Density 1.8 - gm/cm3 - ASTM D792
Copper Peel Strength 6.3 (1.1) - lbs/in (N/mm) 1 oz. EDC post solder float IPC-TM-650, 2.4.8
Flammability NON FR - - - UL 94
Lead-Free Process Compatible Yes - - - -
 
Rogers RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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