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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

  • Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers
  • Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers
Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-114-V1.1
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-6.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Glass Epoxy: RO4360G2
Final Foil: 1 Oz Final Height Of PCB: 0.3 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.

 

RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.

 

RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. They are the best value choice for engineers working on designs including power amplifiers, patch antennas, ground-based radar, and other general RF applications.

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers 0

 

Features and benefits:

1. Thermoset resin system specially formulated to meet 6.15 Dk

1). Ease of fabrication / processes similar to FR-4

2). Material repeatability

3). Low loss

4). High thermal conductivity

5). Lower total PCB cost solution than competing PTFE products,

 

2. Low Z-axis CTE / High Tg

1). Design flexibility

2). Plated through-hole reliability

3). Automated assembly compatible

 

3. Environmentally friendly

1.) Lead free process compatible

 

4. Regional finished goods inventory

1). Short lead times / quick inventory turns

2). Efficient supply chain

 

 

Some Typical Applications:

1. Base Station Power Amplifiers

2. Small Cell Transceivers

3. Patch antennas

4. Ground-based Radar

 

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers 1

 

PCB Capability (RO4360G2)

PCB Material: Hydrocarbon Ceramic-filled Thermoset Materials
Designation: RO4360G2
Dielectric constant: 6.15 ±0.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

 

Data Sheet of RO4360G2

RO4360G2 Typical Value
Property RO4360G2 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23 IPC-TM-650 2.5.5.5
2.5 GHz/23
Dissipation Factor,tanδ 0.0038 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Conductivity 0.75   W/mK 50 ASTM D-5470
Volume Resistivity 4.0 X 1013   Ω.cm Elevated T IPC-TM-650 2.5.17.1
Surface Resistivity 9.0 X 1012   Ω Elevated T IPC-TM-650 2.5.17.1
Electrical Strength 784 Z V/mil   IPC-TM-650 2.5.6.2
Tensile Strength 131 (19) 97(14) X Y MPa (kpsi) 40 hrs 50%RH/23 ASTM D638
Flexural Strength 213(31) 145(21) X Y Mpa (kpsi) 40 hrs 50%RH/23 IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion 13 14 28 X Y Z ppm/ -50 to 288 After Replicated Heat Cycle IPC-TM-650, 2.1.41
Tg >280   ℃ TMA   IPC-TM-650 2.4.24.3
Td 407     ASTM D3850 using TGA
T288 >30 Z min 30 min / 125 Prebake IPC-TM-650 2.2.24.1
Moisure Absorption 0.08   % 50/48hr IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er -131 @10 GHz Z ppm/℃ -50 to 150 IPC-TM-650, 2.5.5.5
Density 2.16   gm/cm3 RT ASTM D792
Copper Peel Stength 5.2 (0.91)   pli (N/mm) Condtion B IPC-TM-650 2.4.8
Flammability V-0       UL 94 File QMTS2. E102765

 

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers 0

 

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers 3

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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