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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver

Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver

  • Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver
  • Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver
Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-102-V8.5
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD2.99-6.99 Per Piece
Packaging Details: Vacuum
Delivery Time: 5-6 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Glass Epoxy: RO3210 Final Height Of PCB: 0.7 Mm ±0.1mm
Final Foil External: 1.0oz Surface Finish: Immersion Gold
Solder Mask Color: Green Colour Of Component Legend: White
Number Of Layers: 2 Test: 100% Electrical Test Prior Shipment

Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver
(PCB's are custom-made products, the picture and parameters shown are just for reference)

 
Hello Everyone,
Today we’re talking about RO3210 high frequency PCBs.
 
RO3210 high frequency circuit laminates are ceramic-filled laminates reinforced with woven fiberglass. RO3210 material was designed as an extension of the RO3000 series high frequency circuit materials with one distinguishing characteristic-- improved mechanical stability.
 
Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver 0
 
Features and benefits are as follows:
1. Woven glass reinforcement, improves rigidity for easier handling.
2, Uniform electrical and mechanical performance, is ideal for complex multi-layer high frequency structure.
3. Low in-plane expansion coefficient matches to copper, which is reliable for surface mounted assemblies; which is suitable for use with epoxy multi-layer board hybrid designs.
4. Excellent dimensional stability, results in high production yields.
5. Surface smoothness, allows for finer line etching tolerance.
 
Our PCB Capability (RO3210)

PCB Material:Ceramic-filled Laminates
Designation:RO3210
Dielectric constant:10.2 ±0.5 (process)
10.8 (design)
Layer count:2 Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:25mil (0.635mm), 50mil (1.27mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..
  

 
Double layer RO3210 high frequency PCBs are available with 0.5oz to 2oz finished copper, 0.7mm and 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.
 
Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver 1
 
Typical applications
1. Automotive collision avoidance systems.
2. Automotive global positions satellite antennas
3. Base station infrastructure
4. Datalink on cable systems
5. Direct broadcast satellite
6. LMDS and wireless broadband
7. Microstrip patch antennas for wireless communications
8. Power backplanes
9. Remote meter readers
10. Wireless telecommunications systems
 
Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver 2
 
The basic colour of RO3210 PCB is white.
 
The manufacturing process of RO3210 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.
Should you have any questions, please feel free to contact us.
Thank you for your reading.
 
Appendix: Data sheet RO3210

RO3210 Typical Value
PropertyRO3210DirectionUnitsConditionTest Method
Dielectric Constant, ε Process10.2±0.5Z 10 GHz 23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, ε Design10.8Z 8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor, tanδ0.0027Z 10 GHz 23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-459Zppm/℃10 GHz 0℃to 100℃IPC-TM-650 2.5.5.5
Dimensional Stability0.8X, Ymm/mCOND AASTM D257
Volume Resistivity103 MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity103 COND AIPC 2.5.17.1
Tensile Modulus579
517
MD
CMD
kpsi23℃ASTM D 638
Water Absorption<0.1-%D24/23IPC-TM-650 2.6.2.1
Specific Heat0.79 j/g/k Calculated
Thermal Conductivity0.81 W/M/K80℃ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
13
34
X,Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
Td500 TGAASTM D3850
Density3 gm/cm3  
Copper Peel Strength11 pli1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0   UL 94
Lead-free Process CompatibleYes    
 
Rogers RO3210 High Frequency PCB with 25mil and 50mil Coating Immersion Gold, Immersion Tin and Immersion Silver 3

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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