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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RO3006 High Frequency PCB

Rogers RO3006 High Frequency PCB

  • Rogers RO3006 High Frequency PCB
  • Rogers RO3006 High Frequency PCB
  • Rogers RO3006 High Frequency PCB
  • Rogers RO3006 High Frequency PCB
  • Rogers RO3006 High Frequency PCB
Rogers RO3006 High Frequency PCB
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-99xx-V1.39
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.88-6.99 per piece
Packaging Details: Vacuum
Delivery Time: 4-5 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Layer, Multilayer, Hybrid PCB Glass Epoxy: RO3006
Final Height Of PCB: 10mil (0.254mm), 25mil (0.635mm) 50mil (1.27mm) Final Foil External: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, OSP Etc.. Solder Mask Color: Green, Black, Blue, Yellow, Red Etc.
Colour Of Component Legend: Green, Black, Blue, Yellow, Red Etc. Test: 100% Electrical Test Prior Shipment

Hello everyone,

Today we’re talk about RO3006 high frequency PCBs.

 

RO3006 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designer to develop multi-layer board without encountering warpage or reliability problems.

Rogers RO3006 High Frequency PCB 0

 

More features and applications are as follows:

Firstly, excellent mechanical properties versus temperature, it’s reliable for stripline and multi-layer board constructions.

Secondly, uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

Thirdly, low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

 

PCB Capability
PCB Material: Ceramic-filled PTFE composite
Designation: RO3006
Dielectric constant: 6.15 ±0.3 (process)
6.5 (design)
Layer count: 2 Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 25mil (0.635mm)
50mil (1.27mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
   

 

RO3006 high frequency PCBs are available with double sided, multi-layer and hybrid construction, 0.5oz to 2oz finished copper, 0.3mm to 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

Rogers RO3006 High Frequency PCB 1

 

Typical applications are

1. Automotive radar applications

2. GPS Antennas

3. Power amplifiers and antennas

4. Patch antennas for wireless communications

5. Direct broadcast satellite

 

Rogers RO3006 High Frequency PCB 2

The basic colour of RO3006 PCB is white.

 

The manufacturing process of RO3006 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.

Should you have any questions, please feel free to contact us.

 

Thank you for your reading.

 

Appendix: RO3006 Typical Value

Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1498
1293
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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