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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers PCB RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210, RO4730, RO4360, RO3203

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Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB

Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB

  • Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB
  • Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB
  • Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB
Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-0037-V0.74
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-9.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Number Of Layers: 2 Glass Epoxy: RO3003
Final Foil: 1 Oz Final Height Of PCB: 0.3 Mm ±10%
Surface Finish: Copper Solder Mask Color: NO
Colour Of Component Legend: NO Test: 100% Electrical Test Prior Shipment

Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

 

Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

 

PCB Specifications

PCB SIZE 100 x 100mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components NO
Through Hole Components NO
LAYER STACKUP copper ------- 35 um(1 oz)
RO3003 0.254mm
copper ------- 35 um(1 oz)
TECHNOLOGY  
Minimum Trace and Space: 5mil / 5mil
Minimum / Maximum Holes: 0.3mm / 0.8mm
Number of Different Holes: N/A
Number of Drill Holes: N/A
Number of Milled Slots: N/A
Number of Internal Cutouts: N/A
Impedance Control: N/A
Number of Gold finger: N/A
BOARD MATERIAL  
Glass Epoxy: RO3003 0.254mm
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 0.3 mm ±0.1
PLATING AND COATING  
Surface Finish N/A
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST N/A
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB 0

 

Data Sheet of Rogers 3003 (RO3003)

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9   j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
16
25
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        
 
 
 
 
 
Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB 1

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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