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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers PCB RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210, RO4730, RO4360, RO3203

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Rogers High Frequency PCB Built on RO4730G3 30mil 0.762mm DK3.0 With Immersion Gold for Wireless Antennas

Rogers High Frequency PCB Built on RO4730G3 30mil 0.762mm DK3.0 With Immersion Gold for Wireless Antennas

  • Rogers High Frequency PCB Built on RO4730G3 30mil 0.762mm DK3.0 With Immersion Gold for Wireless Antennas
  • Rogers High Frequency PCB Built on RO4730G3 30mil 0.762mm DK3.0 With Immersion Gold for Wireless Antennas
  • Rogers High Frequency PCB Built on RO4730G3 30mil 0.762mm DK3.0 With Immersion Gold for Wireless Antennas
Rogers High Frequency PCB Built on RO4730G3 30mil 0.762mm DK3.0 With Immersion Gold for Wireless Antennas
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-0059-V0.94
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-9.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Glass Epoxy: RO4730G3
Final Foil: 1.0 Final Height Of PCB: 0.8 Mm ±10%
Surface Finish: Immersion Gold (51.3% ) 0.05µm Over 3µm Nickel Solder Mask Color: N/A
Colour Of Component Legend: N/A Test: 100% Electrical Test Prior Shipment

Rogers RO4730G3 Microwave PCB Board 2-Layer Rogers 4730 30mil 0.762mm Circuit Board DK3.0 DF 0.0028 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.

 

RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.

 

Typical application is cellular base station antennas.

 

Rogers High Frequency PCB Built on RO4730G3 30mil 0.762mm DK3.0 With Immersion Gold for Wireless Antennas 0

 

General description

This is a type of double sided RF PCB built on 0.762mm (30mil) RO4730G3 for the application of Wireless telecommunications antennas.

 

Basic specifications

Base material: RO4730G3 30mil (0.762mm)

Dielectric constant: 3.0+/-0.5

Layer count: 2 layers

Type: Through holes

Format: 110mm x 100mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 1.1 mm

Standard: IPC 6012 Class 2

Packing: 20 pieces are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months

 

 

Data Sheet of Rogers 4730 (RO4730G3)

RO4730G3 Typical Value
Property RO4730G3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.5 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 2.98 Z   1.7 GHz to 5 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0028 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
  2.5 GHz
Thermal Coefficient of ε +34 Z ppm/℃ -50 ℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability <0.4 X, Y mm/m after etech +E2/150 ℃ IPC-TM-650 2.4.39A
Volume Resistivity (0.030") 9 X 107   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity (0.030") 7.2 X 105   COND A IPC-TM-650 2.5.17.1
PIM -165   dBc 50 ohm 0.060" 43 dBm 1900 MHz
Electrical Strength (0.030") 730 Z V/mil   IPC-TM-650 2.5.6.2
Flexural Strength MD 181 (26.3)   Mpa (kpsi) RT ASTM D790
CMD 139 (20.2)  
Moisure Absorption 0.093 - % 48/50 IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity 0.45 Z W/mK 50℃ ASTM D5470
Coefficient of Thermal Expansion 15.9
14.4
35.2
X
Y
Z
ppm/℃ -50 ℃to 288℃ IPC-TM-650 2.4.4.1
Tg >280     IPC-TM-650 2.4.24
Td 411     ASTM D3850
Density 1.58   gm/cm3   ASTM D792
Copper Peel Stength 4.1   pli 1oz,LoPro EDC IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        
 
 
Rogers High Frequency PCB Built on RO4730G3 30mil 0.762mm DK3.0 With Immersion Gold for Wireless Antennas 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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