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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers 3210 PCB RO3210 High Frequency PCB for Base station infrastructure

Rogers 3210 PCB RO3210 High Frequency PCB for Base station infrastructure

  • Rogers 3210 PCB RO3210 High Frequency PCB for Base station infrastructure
  • Rogers 3210 PCB RO3210 High Frequency PCB for Base station infrastructure
  • Rogers 3210 PCB RO3210 High Frequency PCB for Base station infrastructure
Rogers 3210 PCB RO3210 High Frequency PCB for Base station infrastructure
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-XXXX-V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Glass Epoxy: RO3210
Final Foil: 1 Oz Final Height Of PCB: 1.2 Mm ±10%
Surface Finish: Immersion Gold (13.9%) 2µ" Over 100µ" Nickel Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Rogers 3210 PCB RO3210 High Frequency PCB

 

Hello Everyone,

Today we’re talking about RO3210 high frequency PCBs.

 

RO3210 high frequency circuit laminates are ceramic-filled laminates reinforced with woven fiberglass. RO3210 material was designed as an extension of the RO3000 series high frequency circuit materials with one distinguishing characteristic-- improved mechanical stability.

Rogers 3210 PCB RO3210 High Frequency PCB for Base station infrastructure 0

 

Features and benefits are as follows:

1. Woven glass reinforcement, improves rigidity for easier handling.

2, Uniform electrical and mechanical performance, is ideal for complex multi-layer high frequency structure.

3. Low in-plane expansion coefficient matches to copper, which is reliable for surface mounted assemblies; which is suitable for use with epoxy multi-layer board hybrid designs.

4. Excellent dimensional stability, results in high production yields.

5. Surface smoothness, allows for finer line etching tolerance.

 

 

PCB Capability

PCB Material: Ceramic-filled Laminates
Designation: RO3210
Dielectric constant: 10.2 ±0.5 (process)
10.8 (design)
Layer count: 2 Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 25mil (0.635mm), 50mil (1.27mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
   

 

Double layer RO3210 high frequency PCBs are available with 0.5oz to 2oz finished copper, 0.7mm and 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

 

Rogers 3210 PCB RO3210 High Frequency PCB for Base station infrastructure 1

Typical applications are

1. Automotive collision avoidance systems.

2. Automotive global positions satellite antennas

3. Base station infrastructure

4. Datalink on cable systems

5. Direct broadcast satellite

6. LMDS and wireless broadband

7. Microstrip patch antennas for wireless communications

8. Power backplanes

9. Remote meter readers

10. Wireless telecommunications systems

 

Rogers 3210 PCB RO3210 High Frequency PCB for Base station infrastructure 2

The basic colour of RO3210 PCB is white.

 

 

The manufacturing process of RO3210 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.

 

Should you have any questions, please feel free to contact us.

Thank you for your reading.

 

 

Appendix

Data sheet of RO3210 high frequency circuit material

RO3210 Typical Value
Property RO3210 Direction Units Condition Test Method
Dielectric Constant, ε Process 10.2±0.5 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, ε Design 10.8 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor, tanδ 0.0027 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -459 Z ppm/℃ 10 GHz 0℃to 100℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X, Y mm/m COND A ASTM D257
Volume Resistivity 103   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 103   COND A IPC 2.5.17.1
Tensile Modulus 579
517
MD
CMD
kpsi 23℃ ASTM D 638
Water Absorption <0.1 - % D24/23 IPC-TM-650 2.6.2.1
Specific Heat 0.79   j/g/k   Calculated
Thermal Conductivity 0.81   W/M/K 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
13
34
X,Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA ASTM D3850
Density 3   gm/cm3    
Copper Peel Strength 11   pli 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        
 
Rogers 3210 PCB RO3210 High Frequency PCB for Base station infrastructure 3
 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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