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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas

RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas

  • RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas
  • RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas
  • RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas
  • RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas
  • RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas
RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-132-V0.19
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-8.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Glass Epoxy: RO4003C LoPro
Final Foil: 1.0 Oz Final Height Of PCB: 0.9 Mm ±10%
Surface Finish: ENIG Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.

 

RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas 0

 

Features and Benefits:

RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

 

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

 

Lead-free process compatible

1. High temperature processing

  • Meets environmental concerns

 

CAF resistant

 

 

Our PCB Capability (RO4003C LoPro)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4003C LoPro
Dielectric constant: 3.38±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

  • Cellular base station antennas and power amplifiers
  • LNB’s for direct broadcast satellites
  • RF Identification Tags

 

Typical Properties of RO4003C LoPro

Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.38 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.5 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0027 0.0021 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 40 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 X 1010   MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 X 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 26889(3900) Y MPa(kpsi) RT ASTM D638
Tensile Strength 141(20.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 276(40)   MPa(kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 11 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
14 y
46 z
Tg >280   °C TMA A IPC-TM-650 2.4.24.3
Td 425   °C TGA   ASTM D3850
Thermal Conductivity 0.64   W/m/°K 80°C ASTM C518
Moisture Absorption 0.06   % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.79   gm/cm3 23°C ASTM D792
Copper Peel Strength 1.05(6.0)   N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-Free Process Compatible Yes        
 
RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas 1
 
RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas 2
 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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