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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP

RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP

  • RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP
  • RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP
  • RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP
  • RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP
RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-0166-V6.4
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD2.99-8.99 Per Piece
Packaging Details: Vacuum
Delivery Time: 5-6 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Glass Epoxy: RF-60TC Final Height Of PCB: 0.8 Mm ±0.1mm
Final Foil External: 1.0 Oz Surface Finish: Immersion Gold
Solder Mask Color: Black Colour Of Component Legend: White
TEST: 100% Electrical Test Prior Shipment

RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP for Miniaturized Antenna

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RF-60TC is a ceramic-filled PolyTetraFluoride(PTFE) based (fiberglass substrate for the PCB of high power RF and microwave applications. It is designed to provide lower operating temperature in high power applications and the 6.15DK market. By improving dielectric heat dissipation and exceptionally lower dielectric losses, a better gain and efficiency are got in miniaturized antenna applications

 

RF-60TC's enhanced heat transfer function allows additional design margin to extend the life of active components and improve long-term reliability.

 

RF-60TC with extremely low profile and reverse treated copper is excellent to reduce insertion loss. Heavy metal based laminate is also available. RF-60TC’s low CTE and improved dimensional stability make it possible to build multi-layer PCB with improved PTH reliability.

 

RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP 0

 

Our PCB Capability (RF-60TC)

PCB Material: PTFE based, ceramic filled fiberglass
Designation: RF-60TC
Dielectric constant: 6.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

 

Benefits:

1. Improved loss tangent

- Lower insertion loss

- Enhanced antenna gain / efficiency

 

2. High thermal conductivity

- Exceptional thermal management

- Lower operating temperature

- Higher power application

- Loong term reliablity

 

3. Enhanced dimensional stability

 

4. Low Z-axis CTE

- Multilayer application available

- Reliable plated through hole

 

5. Excellent adhesion to metal

- Lower profile copper available

- Heavy metal back available

 

6. Stable DK over frequency

7. Stable DK over temperature

8. Low moisture absorption

 

RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP 1

RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP 2

RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP 3

Applications:

High power amplifier

Miniaturized antennas (GPS / PATCH / RFID Reader)

Filters, couplers, dividers

Satellites

 

 

Typical Value of RF-60TC

RF-60TC Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   6.15 ± 0.15   6.15 ± 0.15
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   0.002   0.002
TcK   ppm/°C -3.581 ppm/°C -3.581
Dielectric Breakdown IPC-650 2.5.6 kV 55 kV 55
Dielectric Strength IPC-650 2.5.6.2 V/mil 550 V/mm 21,654
Arc Resistance IPC-650 2.5.1 Seconds >180 Seconds >180
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Flexural Strength (MD) IPC-650 2.4.4 psi 10,000 N/mm2 69
Flexural Strength (CD) IPC-650 2.4.4 psi 9,000 N/mm2 62
Tensile Strength (MD) IPC-650 2.4.19 psi 9,000 N/mm2 62
Tensile Strength (CD) IPC-650 2.4.19 psi 7,000 N/mm2 48
Young’s Modulus (MD) ASTM D 3039/IPC-TM-650 2.4.19 kpsi 721 N/mm2 4971
Poisson’s Ratio (MD) ASTM D 3039/IPC-TM-650 2.4.19   0.155   0.155
Peel Strength (1 oz. ED) IPC-650 2.4.8 lbs/in 8 N/mm 1.43
Thermal Conductivity (Unclad) IPC-650 2.4.50 W/M*K 0.9 W/M*K 0.9
Thermal Conductivity (CH/CH) IPC-650 2.4.50 W/M*K 1 W/M*K 1
Thermal Conductivity (C1/C1) IPC-650 2.4.50 W/M*K 1.05 W/M*K 1.05
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.01 mm/M 0.01
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.69 mm/M 0.69
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.06 mm/M 0.06
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.8 mm/M 0.8
Surface Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm 1.0 x 108 Mohm 1.0 x 108
Volume Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm/cm 1.0 x 108 Mohm/cm 1.0 x 108
CTE (X, Y axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 9.9 ppm/°C 9.9
CTE (Z axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 40 ppm/°C 40
Density (Specific Gravity) IPC-650 2.3.5 g/cm3 2.84 g/cm3 2.84
Specific Heat IPC-650 2.4.50 J/gK 0.94 J/gK 0.94
Td (2% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 930 °C 500
Td (5% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 960 °C 515
Flammability Rating UL 94   V-0   V-0
 
RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP 4

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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