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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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RF-60A 31mil (0.80mm) Taconic Double Layer RF PCB With Immersion Gold For Antennas

RF-60A 31mil (0.80mm) Taconic Double Layer RF PCB With Immersion Gold For Antennas

  • RF-60A 31mil (0.80mm) Taconic Double Layer RF PCB With Immersion Gold For Antennas
  • RF-60A 31mil (0.80mm) Taconic Double Layer RF PCB With Immersion Gold For Antennas
RF-60A 31mil (0.80mm) Taconic Double Layer RF PCB With Immersion Gold For Antennas
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-144-V6.24
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD20~30
Packaging Details: Vacuum
Delivery Time: 5-6 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Glass Epoxy: RF-60A Final Height Of PCB: 0.8 Mm ±0.1
Final Foil External: 1.0 Oz Surface Finish: ENIG
Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied. Colour Of Component Legend: White, IJR-4000 MW300, Taiyo Supplied.
TEST: 100% Electrical Test Prior Shipment

RF-60A 31mil (0.80mm) Taconic Double Layer RF PCB With Immersion Gold For Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RF-60A is an organic-ceramic laminate in the ORganic CERamic(ORCER) family of Taconic products. It's based on woven glass reinforcement. It is a result of Taconic's expertise in both ceramic fill technology and in coated PTFE fiberglass. RF-60A exhibits exceptional interlaminar bond strength and solder resistance. Its proprietary composition results in low moisture absorption and uniform electrical properties.

 

RF-60A 31mil (0.80mm) Taconic Double Layer RF PCB With Immersion Gold For Antennas 0

 

RF-60A's woven glass reinforcement ensures excellent dimentional stability and enhances flexural strength. It exhibits low Z-axis expansion allowing for plated-through-hole reliablity in extreme thermal environments. With a dielectric constant of approximately 6.15, it is ideal high DK products for applications requiring reduced circuit size and weight. The low electrical loss factor makes it an excellent selection for RF circuits.

 

RF-60A 31mil (0.80mm) Taconic Double Layer RF PCB With Immersion Gold For Antennas 1

 

RF-60A laminates are in complete compliance with RoHS and WEEE directives and are compatible with the temperatures required for the new lead free solders. They can be sheared, drilled, milled and plated using standard methods for PTFE-woven fiberglass materials, so mass production becomes possible.

 

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Our PCB Capabilities (RF-60A)

PCB Material: Organic-ceramic Woven Fiberglass Reinforced Laminates
Designation: RF-60A
Dielectric constant: 6.15 ±0.25
Dissipation Factor DF 0.0038@10 GHz
Thermal Conductivity 0.4 W/MK
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 25mil (0.635mm), 31mil (0.787mm), 50mil (1.27mm), 60mil (1.524mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Benefits (in general):

Low Moisture Absorption

Stable DK over Frequency

Dimensionally Stable

Low Z-axis Expansion

High Flexural Strength

Exceptional Interlaminar Bonds

 

Typical Applications:

Power Amplifiers

Filters & Couplers

Passive Components

Antennas

 

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Data Sheet of Taconic RF-60A

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.6   6.15   6.15
Df @ 10 GHz IPC-650 2.5.5.5.1   0.0038   0.0038
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV 53 kV 53
Dielectric Strength ASTM D 149 V/mil 880 kV/mm 35
Volume Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm/cm 9.0 x 108 Mohm/cm 9.0 x 108
Surface Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm 2.28 x 108 Mohm 2.28 x 108
Arc Resistance IPC-650 2.5.1 Seconds 193 Seconds 193
Flexural Strength (MD) ASTM D 790 psi 18,300 N/mm2 126.2
Flexural Strength (CD) ASTM D 790 psi 14,600 N/mm2 100.7
Tensile Strength (MD) ASTM D 3039 psi 19,500 N/mm2 134.4
Tensile Strength (CD) ASTM D 3039 psi 16,300 N/mm2 112.4
Young’s Modulus ASTM D 3039 kpsi 1,590 N/mm2 11,000
Poisson’s Ratio ASTM D 3039   0.068 N/mm2 0.068
Compressive Modulus ASTM D 695 (23°C) kpsi 338   2,330
Peel Strength (1 oz. ED) IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) lbs/in 8 N/mm 1.4
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.68 mm/M 0.68
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 1.05 mm/M 1.05
Density (Specific Gravity) ASTM D 792 g/cm3 2.79 g/cm3 2.79
Thermal Conductivity ASTM F 433 W/M*K 0.4 W/M*K 0.4
CTE (X axis) ASTM D 3386 (-30°C - 125°C) ppm/°C 9 ppm/°C 9
CTE (Y axis) ASTM D 3386 (-30°C - 125°C) ppm/°C 8 ppm/°C 8
CTE (Z axis) ASTM D 3386 (-30°C - 125°C) ppm/°C 69 ppm/°C 69
Outgassing (% TML) ASTM E 595* % 0.02 % 0.02
Outgassing (% CVCM) ASTM E 595* % 0.00 % 0.00
Outgassing (% WVR) ASTM E 595* % 0.01 % 0.01
Flammability Rating UL 94   V-0   V-0

 

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Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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