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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Printed Circuit Board (PCB) Built on 1.6mm High Tg TU-872 SLK Sp (Low DK FR-4) With Immersion Gold for Radio Frequency

Printed Circuit Board (PCB) Built on 1.6mm High Tg TU-872 SLK Sp (Low DK FR-4) With Immersion Gold for Radio Frequency

  • Printed Circuit Board (PCB) Built on 1.6mm High Tg TU-872 SLK Sp (Low DK FR-4) With Immersion Gold for Radio Frequency
  • Printed Circuit Board (PCB) Built on 1.6mm High Tg TU-872 SLK Sp (Low DK FR-4) With Immersion Gold for Radio Frequency
  • Printed Circuit Board (PCB) Built on 1.6mm High Tg TU-872 SLK Sp (Low DK FR-4) With Immersion Gold for Radio Frequency
  • Printed Circuit Board (PCB) Built on 1.6mm High Tg TU-872 SLK Sp (Low DK FR-4) With Immersion Gold for Radio Frequency
Printed Circuit Board (PCB) Built on 1.6mm High Tg TU-872 SLK Sp (Low DK FR-4) With Immersion Gold for Radio Frequency
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-501-V5.3
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD20~30
Packaging Details: Vacuum
Delivery Time: 4-5 working days
Payment Terms: T/T,Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 4 Glass Epoxy: TU-872 SLK Sp
Final Height Of PCB: 1.6mm ±0.16 Final Foil External: 1.5 Oz
Surface Finish: Electroless Nickel Over Immersion Gold (ENIG)( 2 Micoinch Over 100 Microinch Nickel) Solder Mask Color: Blue
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Printed Circuit Board (PCB) Built on 1.6mm High Tg TU-872 SLK Sp (Low DK FR-4) With Immersion Gold for Radio Frequency Applications.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of low DK/DF FR-4 PCB which is built on TU-872 SLK Sp material (more details, please refer to “Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp) It is made on 4 layers copper with 1oz each layer, coating immersion gold and matt blue solder mask. Final finished thickness is 1.6mm +/- 10%. A panel consists of 10 pieces.

 

Applications

1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers

 

Printed Circuit Board (PCB) Built on 1.6mm High Tg TU-872 SLK Sp (Low DK FR-4) With Immersion Gold for Radio Frequency 0

 

PCB Specifications

 

Item Description Requirement Actual Result
1. Laminate Material Type FR-4 TU-872 SLK Sp FR-4 TU-872 SLK Sp ACC
Tg 170 170 ACC
Supplier TU TU ACC
Thickness 1.6 ±10% mm 1.61-1.62 mm ACC
2.Plating thickness Hole Wall 25 µm 26.51 µm ACC
Outer copper 35 µm 40.21 µm ACC
Inner Copper 30 µm 31.15 µm ACC
3.Solder mask Material Type Kuangshun Kuangshun ACC
Color Blue Blue ACC
Rigidity (Pencil Test) 4H or above 5H ACC
S/M Thickness 10 µm 19.55 µm ACC
Location Both Sides Both Sides ACC
4. Component Mark Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S, S/S C/S, S/S ACC
5. Peelable Solder Mask Material Type      
Thickness      
Location      
6. Identification UL Mark YES YES ACC
Date Code WWYY 0421 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method Immersion Gold Immersion Gold ACC
Tin Thickness          
Nickel Thickness 3-6 µm 5.27 µm ACC
Gold Thickness 0.05 µm 0.065 µm ACC
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring Min. Line Width (mil) 7.00 mil 6.80 mil ACC
Min. Spacing (mil) 6.00 mil 6.20 mil ACC
10.V-groove Angle      
Residual thickness          
11. Beveling Angle      
Height      
12. Function Electrical Test 100% PASS 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist 0.70% 0.32% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5 OK ACC
Thermal Stress Test 288 ±5 OK ACC
Ionic Contamination Test 1.56 µg/c 0.58 µg/c ACC

 

Printed Circuit Board (PCB) Built on 1.6mm High Tg TU-872 SLK Sp (Low DK FR-4) With Immersion Gold for Radio Frequency 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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