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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Metal Core PCB Built On Aluminium Base With Panel Shipment for LED Lighting

Metal Core PCB Built On Aluminium Base With Panel Shipment for LED Lighting

  • Metal Core PCB Built On Aluminium Base With Panel Shipment for LED Lighting
  • Metal Core PCB Built On Aluminium Base With Panel Shipment for LED Lighting
  • Metal Core PCB Built On Aluminium Base With Panel Shipment for LED Lighting
  • Metal Core PCB Built On Aluminium Base With Panel Shipment for LED Lighting
  • Metal Core PCB Built On Aluminium Base With Panel Shipment for LED Lighting
Metal Core PCB Built On Aluminium Base With Panel Shipment for LED Lighting
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0582-V5.82
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD20~30
Packaging Details: Vacuum
Delivery Time: 4-5 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Thermal Conductivity: 2.0W/MK 75um Dielectric Material, CTI 600V Final Height Of PCB: 1.6mm ±0.16
Final Foil External: 1 Oz Surface Finish: Hot Air Soldering Leveling(HASL),lead Free, Sn>=2.54µm
Solder Mask Color: Super White, Taiyo PSR400 WT02 Colour Of Component Legend: Black
TEST: 100% Electrical Test Prior Shipment

General Profile

 


Metal core PCB is thermal management circuit board used in LED lighting which
needs fast cooling dissipation. The metal core can be aluminum (aluminum core
PCB) and copper (copper core PCB), even iron base. The fastest speed of heat
transfer is on copper which is designed in the form of thermoelectric separation.

 

 

 

Advantages

 


1) Effective heat dissipation reduces the operating temperature of the module
    and prolongs the service life;
2) Power density and reliability are improved up 10%;
3) Reduce the dependence of heat sinks and other hardware (including thermal
    interface materials);
4) Reduce the volume of the product;
5) Reduce the cost of hardware and assembly;
6) Optimization combination of power circuit and control circuit;
7) Replace the fragile ceramic substrate and obtain a better mechanical durability;
8) Reduce the operating temperature of the equipment;

 

 

 

Applications

 


LED lighting, Switch regulator, DC/AC converter, Communication electronic
equipment, A filter electric circuit, Office automation equipment, Motor driver,
Motor controller, Automobile etc.

 

 

 

Metal Core PCB Capability

NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, OSP
4 Thickness of Surface plating HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5 Layer Count 1-4 Layers
6 Maximum of Board Size 23" x 46" (584mm×1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm×5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness

0.5OZ(17.5µm),1OZ(35µm),

2OZ(70µm),3OZ(105µm),

4OZ(140µm) to 10oz (350µm)

10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20µm
16 Tolerance of PTH ±0.00295" (0.075mm)
17 Tolerance of NPTH ±0.00197" (0.05mm)
18 Deviation of Hole Position ±0.00394" (0.10mm)
19 Outline Tolerance Routing: ±0.00394" (0.1mm)
Punching: ±0.00591" (0.15mm)
20 Angle of V-cut 30°, 45°, 60°
21 V-cut Size 0.1969" x 47.24" (5mm×1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle ±5º
24 V-CUT Verticality ≤0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13µm (0.013mm)
29 Insulation Resistance 1012ΩNormal
30 Peel-off Strength 2.2N/mm
31 Solder float 260℃ 3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist ≤0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)

 

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Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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