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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

  • Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880
  • Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880
Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-0073-V1.12
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-9.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 3 Glass Epoxy: RO4350B+ RT/duroid 5880
Final Foil: 1.0 Final Height Of PCB: 1.8 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

 

The hybrid PCB can be a mixture of FR-4 and high frequency material, and a mixture of high frequency material with different dielectric constant (DK), for example RT/duroid 5880 and RO4350B etc.

 

Today we’ll talk about a type of mixed high frequency PCB made on 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/duroid 5880. It’s for the application of multi-coupler antenna.

 

Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880 0

 

This is a 3-layer board that one layer is etched off.

 

The basic specifications are as follows:

Base material: RO4350B 13.3mil (0.338mm) + RT/duroid 5880 31 mil (0.787mm)

Dielectric constant: 3.48+/-0.05

Layer count: 3 layers

Via type: Through holes, blind vias

Format: 160mm x 90mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35μm | Inner layer 35μm

Solder mask / Legend: Green / White

Final PCB height: 1.3 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

 

Features and benefits

1) Lowest electrical loss for reinforeced PTFE material

2) Enhanced electrical performance;

3) 16000 square meter workshop;

4) 30000 square meter month capability;

5) 8000 types of PCB's per month;

6) More than 17 years of PCB experience;

 

Applications

Point to Point Digital Radio Antennas, WiFi Amplifier, Tower-mounted Booster, Power Amplifier, RF Module

 

Properties of RT/duroid 5880

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23 Test at 100 N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80 ASTM C 518
Coefficient of Thermal Expansion 31
48
237
X
Y
Z
ppm/ 0-100 IPC-TM-650 2.4.41
Td 500 N/A TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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