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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers PCB RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210

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Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin

Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin

  • Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin
  • Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin
  • Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin
Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-161-V5.9
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD2.99-5.99 Per Piece
Packaging Details: Vacuum
Delivery Time: 5-6 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Glass Epoxy: RO4003C Tg280℃, Er<3.48, Rogers Corp. Final Height Of PCB: 1.6 Mm ±0.1mm
Final Foil External: 1.0 Oz Surface Finish: Immersion Gold
Solder Mask Color: N/A Colour Of Component Legend: Black
TEST: 100% Electrical Test Prior Shipment

Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Hi Everyone,

Today, we’re going to talk about a type of 4-layer high frequency PCB made on 16mil core of RO4003C.

 

The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive, which is helpful to open up a new market.

 

Let’s see the stack-up first.

Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin 0

 

Viewing from stack up, we can see the 1st layer to the 2nd layer and 4th layer to 3rd layer are 12mil core of RO4003C and 16mil core of RO4003C, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the 2 cores are bonded by bonding film -Prepreg.

 

At present, there’re 2 types of PP used in multi-layer high frequency PCB’s. That is FR-4 dielectric and high frequency dielectric, such as RO4450F, Cuclad 6250, Taconic’s FastRise-28 (FR-28) etc.

 

Copper weight on inner layer is half ounces, outer layers 1 ounce. Blind vias are drilled on both cores.

 

Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin 1

 

The 2nd board is a mixed PCB, FR-4 is used on layer 3 and layer 4, high frequency signal transmit on high frequency substrate: L1 and L2. According to the actual applications, the thickness of dielectric material and FR-4 can be adjusted.

 

Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin 2

 

The application of 16mil RO4003C hybrid PCB is wide, such as modular oscilloscope, antenna combiner, balanced amplifier, 4G antenna etc.

 

The advantages of 16mil RO4003C hybrid PCB are shown as follows:

1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Reducing signal loss in high frequency application meets the development needs of communication technology.

3) Cost reduced over stack-ups with all low loss material;

 

Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin 3

 

Standard thickness of RO4003C are 0.008” (0.203mm), 0.012” (0.305mm), 0.016” (0.406mm), 0.020” (0.508mm), 0.032” (0.813mm) and 0.060” (1.524mm). These thickness are available in house. Welcome your patronage.

 

Data Sheet of Rogers 4003C (RO4003C)

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin 4

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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