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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

  • High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
  • High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
  • High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
  • High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
  • High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-502-V0.55
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-9.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 4 Glass Epoxy: TU-768
Final Foil: 1.5 Oz Final Height Of PCB: 1.6 Mm ±10%
Surface Finish: HASL LF Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

 

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg 0

 

Main Applications

Consumer Electronics

Server, workstation

Automotive

 

Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance

 

Our PCB Capability (TU-768)

PCB Material: High-Tg and High Thermal Reliability Epoxy Resin
Designation: TU-768
Dielectric constant: 4.3
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg 1

 

Typical Properties of TU-768

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 190°C    
Tg (DSC) 180°C   > 170°C
Tg (TMA) 170°C E-2/105  
Td (TGA) 350°C   > 340°C
CTE x-axis 11~15 ppm/°C   N/A
CTE y-axis 11~15 ppm/°C E-2/105 N/A
CTE z-axis 2.70%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 > 60 min   > 30 min
T288 > 20 min E-2/105 > 15 min
T300 > 2 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 4.3    
Loss Tangent (RC 50%) @10GHz 0.018    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 4.4 / 4.3   < 5.2
5GHz (SPC method) 4.3 E-2/105 N/A
10GHz (SPC method) 4.3   N/A
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.019 /0.018   < 0.035
5GHz (SPC method) 0.021 E-2/105 N/A
10GHz (SPC method) 0.023   N/A
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 KV/mm
Dielectric Breakdown > 50 kV A > 40 KV
Mechanical      
Young’s Modulus      
Warp Direction 25 GPa A N/A
Fill Direction 22 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 7~9 lb/in A > 4 lb/in
Water Absorption 0.18% E-1/105+D-24/23 < 0.8 %
 
 
 
High-Tg Lead Free Green Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg 2
 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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