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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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High Frequency PCB Built on Taconic RF-35TC DK3.5 With 60mil Thick and Immersion Gold for Power Amplifier

High Frequency PCB Built on Taconic RF-35TC DK3.5 With 60mil Thick and Immersion Gold for Power Amplifier

  • High Frequency PCB Built on Taconic RF-35TC DK3.5 With 60mil Thick and Immersion Gold for Power Amplifier
  • High Frequency PCB Built on Taconic RF-35TC DK3.5 With 60mil Thick and Immersion Gold for Power Amplifier
High Frequency PCB Built on Taconic RF-35TC DK3.5 With 60mil Thick and Immersion Gold for Power Amplifier
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-101-V8.3
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD2.99-6.99 Per Piece
Packaging Details: Vacuum
Delivery Time: 5-6 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Glass Epoxy: RF-35TC Final Height Of PCB: 1.6 Mm ±0.16mm
Final Foil External: 2oz Surface Finish: Immersion Gold
Solder Mask Color: Black Colour Of Component Legend: White
Number Of Layers: 2 Test: 100% Electrical Test Prior Shipment

High Frequency PCB Built on Taconic RF-35TC DK3.5 With 60mil Thick and Immersion Gold for Power Amplifier

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello Everyone,

Today, we introduce a type of high frequency PCB built on RF-35TC.

RF-35TC is a PTFE based, ceramic filled fiberglass high frequency material from Taconic company.

 

PCB Specifications

Layer count: Double sided
Base material: RF-35TC DK 3.5
Dimension: 105 x 87mm
Finished thickness 1.6mm ±10%
Finished Copper weight: 2 oz
SMOBC: No
Surface finish: Immersion Gold

 

Double sided, substrate is RF-35TC, DK at 3.5; 105mm long by 87mm wide; finished PCB thickness at 1.6mm, finished copper weight at 2oz; No solder mask and silkscreen; surface finish is Immersion gold

 

This is the stack up drawing.

 

High Frequency PCB Built on Taconic RF-35TC DK3.5 With 60mil Thick and Immersion Gold for Power Amplifier 0

 

Top layer and bottom layer are 2oz finished copper, dielectric material RF-35TC is in the middle at 1.524mm thick, DK at 3.5

 

High Frequency PCB Built on Taconic RF-35TC DK3.5 With 60mil Thick and Immersion Gold for Power Amplifier 1

 

The basic colour of RF-35TC PCB is brown and grey. Its main applications are power amplifiers, couplers and filters. In addition, It’s also widely used in antennas, satellite equipment and so on.

 

Our PCB Capability (RF-35TC)

PCB Material: PTFE based ceramic filled fiberglass substrate
Designator: RF-35TC
Dielectric constant @ 10GHz: 3.50
Layer count: 2 Layer, Multilayer, Hybrid type
Copper weight: 0.5oz, 1oz, 2oz
PCB thickness: 0.3mm, 0.6mm, 0.8mm, 1.6mm
(10mil, 20mil, 30mil, 60mil substrate)
Solder mask: Green, Red, Black, White, Blue etc.
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin etc.
   

 

We can provide you with double sided board, multilayer board and hybrid board. Thickness ranges from 0.3mm to 1.6mm, maximum size at 400 mm by 500mm; there’re surface finishes of bare copper, hot air level, immersion gold etc.

 

RF-35TC offers superior heat dissipation performance, so it's a type of thermally conductive low loss laminate. It's best suited for high power applications. Heat dissipates away from both transmission line on PCB and surface mount components such as capacitor etc.

 

Should you have any questions, please feel free to contact us.

Thank you for reading.

 

Appendix: Data sheet RF-35TC

RF-35TC TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.5.1(modified)   3.5   3.5
Tck(-30 to 120℃) IPC-650 2.5.5.5.1(modified) ppm 24 ppm 24
Df @10 GHz IPC-650 2.5.5.5.1(modified)   0.0011   0.0011
Dielectric Breakdown IPC-650 2.5.6(in-Plane,Two Pins in Oil) kV 56.7 kV 56.7
Dielectric Strength ASTM D 149(Through Plane) V/mil 570 V/mm 22,441
Arc Resistance IPC-650 2.5.1 Seconds 304 Seconds 304
Moisture Absorption IPC-650 2.6.2.1 % 0.05 % 0.05
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 12,900 N/mm2 88.94
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 11,700 N/mm2 80.67
Tensile Strength(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 9,020 N/mm2 62.19
Tensile Strength(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 7,740 N/mm2 53.37
Elongation at Break(MD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.89 N/mm 1.89
Elongation at Break(CD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.7 % 1.7
Young's Modulus(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 667,000 N/mm2 4,599
Young's Modulus(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 637,000 N/mm2 4,392
Poisson's Ratio(MD) ASTM D 3039/IPC-TM-650 2.4.19   0.18   0.18
Poisson's Ratio(CD) ASTM D 3039/IPC-TM-650 2.4.19   0.23   0.18
Compressive Modulus ASTM D 695(23) psi 560,000 N/mm2 3,861
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 1.46 x 106 N/mm2 10,309
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 1.50 x 106 N/mm2 10,076
Peel Stength(½ oz.CVH) IPC-650 2.4.8(Thermal Stress.) Ibs./inch 7 g/cm3 1.25
Thermal Conductivity(Unclad,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.6 W/(mK) 0.6
Thermal Conductivity(C1/C1,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.92 W/(mK) 0.92
Thermal Conductivity(CH/CH,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.87 W/(mK) 0.87
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.23 mm/M 0.23
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.64 mm/M 0.64
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. -0.04 mm/M -0.04
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.46 mm/M 0.46
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 8.33 x 107 Mohms 8.33 x 107
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 6.42 x 107 Mohms 6.42 x 107
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 5.19 x 108 Mohms/cm 5.19 x 108
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 2.91 x 108 Mohms/cm 2.91 x 108
CTE(X axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 11 ppm/ 11
CTE(Y axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 13 ppm/ 13
CTE(Z axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 34 ppm/ 34
Density ASTM D 792 g/cm3 2.35 g/cm3 2.35
Hardness ASTM D 2240(Shore D)   79.1   79.1
Strain at Break(MD) ASTM D 790/IPC-650 2.4.4 % 0.014 % 0.014
Strain at Break(CD) ASTM D 790/IPC-650 2.4.4 % 0.013 % 0.013
Specific Heat ASTM E 1269-05,E 967-08,E968-02 j/(g) 0.94 j/(g) 0.94
Td(2% Weight Loss) IPC-650 2.4.24.6/TGA oF 788 420
Td(5% Weight Loss) IPC-650 2.4.24.6/TGA oF 817 436
High Frequency PCB Built on Taconic RF-35TC DK3.5 With 60mil Thick and Immersion Gold for Power Amplifier 2

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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