RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
|Place of Origin:||China|
|Brand Name:||Bicheng Technologies Limited|
|Minimum Order Quantity:||1|
|Delivery Time:||7 working days|
|Payment Terms:||T/T, Paypal|
|Supply Ability:||45000 pieces per month|
|Board Material:||Polyimide (PI) 25µm ITEQ 60℃||Board Thickness:||0.25mm|
|Surface Cu Thickness:||35µm (1oz)||Surface Finish:||Immersion Gold|
|Coverlay Colour:||Black||Color Of Silkscreen:||White|
|Function:||100% Pass Electrical Test|
Flexible Printed Circuits (FPC) with FR-4 Stiffener Flexible PCB with FR4 Stiffener
(FPC’s are custom-made products, the picture and parameters shown are just for reference)
This is a type of flexible printed circuit for the application of Surveillance System. It’s a single layer FPC at 0.15mm thick. The base laminate is from Shengyi, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. FR-4 as stiffener is applied on the 4 tails and polyimide stiffener on the inserting heads.
Parameter and Data Sheet
|Size of Flexible PCB||230.5 X 30.8mm|
|Number of Layers||1|
|Board Type||Flexible PCB|
|Board Material||Polyimide (PI) 25µm|
|Board Material Supplier||ITEQ|
|Tg Value of Board Material||60℃|
|PTH Cu thickness||≥20 µm|
|Inner Iayer Cu thicknes||N/A|
|Surface Cu thickness||35µm (1oz)|
|Number of Coverlay||2|
|Thickness of Coverlay||25 µm|
|Type of Silkscreen Ink||IJR-4000 MW300|
|Supplier of Silkscreen||TAIYO|
|Color of Silkscreen||White|
|Number of Silkscreen||1|
|Peeling test of Coverlay||No peelable|
|Legend Adhesion||3M 90℃ No peeling after Min. 3 times test|
|Surface Finish||Immersion Gold|
|Thickness of Nickle/Gold||Au: 0.03µm(Min.); Ni 2-4µm|
|Thermal Shock Test||Pass, -25℃±125℃, 1000 cycles.|
|Thermal Stress||Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.|
|Function||100% Pass electrical test|
|Workmanship||Compliance with IPC-A-600H & IPC-6013C Class 2|
Features and Benefits
Reducing the volume
Consistency of assembly
Continuity of processing
No minimum order quantity and low cost sample.
Mobile phone built-in antenna FPC, Mobile phone battery flex board, industrial surveying and mapping instrument
In many applications where there are components soldered, the flexible boards require external stiffeners (Stiffener, also known as the reinforcing board) for external support. The stiffener materials are PI or Polyester film, glass fiber, polymer materials, steel foil, aluminum shim and so on.
PI or Polyester
PI and polyester films are commonly used stiffener materials for flexible circuit board. The commonly used thickness is 125μm (5mil), some hardness can be obtained.
Glass fibers (such as FR-4), which are also commonly used materials for stiffeners. The fiber glass stiffener has a higher hardness than that of PI or Polyester, used where the requirements of harness is higher. The thickness range is typically 125μm (5mil) to 3.175mm (125mils). However, its processing is relatively difficult than PI, and may not be a standing material for some FPC factories.
Polymer, such as plastic, etc. is also used as stiffeners.
Its water absorption is low, with high pressure and high temperature resistance.
Steel foil, aluminum shim
The support hardness of steel foil, aluminum shim is high, the heat can also be dissipated. The hardness or heat dissipation in the design is the main concern.
More Displays of FR-4 Stiffener
Contact Person: Mr. Kevin Liao