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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask

Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask

  • Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask
  • Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask
  • Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask
  • Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask
  • Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask
  • Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask
  • Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask
Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-259-V3.92
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Board Material: PET 25µm ITEQ 60℃ Board Thickness: 0.25mm
Surface Cu Thickness: 70um Surface Finish: Immersion Gold
Coverlay Colour: Black / Green Solder Mask Color Of Silkscreen: White
Function: 100% Pass Electrical Test

Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask

(FPC’s are custom-made products, the picture and parameters shown are just for reference)

 

General description

This type of flexible printed circuit is on polyimide material for the application of gigabyte switch. It’s a 2 layer FPC at 0.25mm thick. Green solder mask is used in the center of the chip area. The base laminate is from Shengyi, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. FR-4 stiffeners are bonded on the inserting head and bottom side.

 

Parameter and data sheet

Size of Flexible PCB 75.22 X 31.17mm
Number of Layers 2
Board Type Flexible PCB
Board Thickness 0.25mm
Board Material PET 25µm
Board Material Supplier ITEQ
Tg Value of Board Material 60℃
 
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes N/A
Surface Cu thickness 70um
   
Coverlay Colour Black / Green solder mask
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material FR-4 / Polyimide
Stiffener Thickness 0.4mm /0.2mm
   
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃ No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles.
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask 0

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Material optionality

Low cost

Continuity of processing

Great customer service

Make delivery on time. We keep higher than 98% on-time-delivery rate.

 

Applications

Toy lamp strip, industrial control audio equipment, Tablet PC module soft board

 

Covercoat / Solder Mask

Solder mask in flexible PCB is different from rigid board, it is usually a polyimide film coated on one side with a semi-cured and non-tacky adhesive, we call it covercoat in flexible circuit. It is laminated to the flexible circuit under heat and pressure, so that the copper pattern is fully encapsulated except for the solder pads that are exposed through access holes in the covercoat.

 

The covercoat production sheet should be cut slightly smaller than the flexible circuit production sheet to avoid premature edge sealing, which could trap air bubbles in the package.

 

The production sheet for the covercoat is provided with tooling holes in close register with the tooling holes in the production sheet for the flexible circuit. The access holes are usually drilled, but in the case of high-volume production, punching is more cost-effective.

 

In principle, drilling of the covercoat is accomplished in the same way as when drilling rigid boards, i.e., a number of covercoat sheets are stacked, either 5-up or 10-up. The drilling parameters, however, are somewhat different, because of the polyimide material and the absence of copper foil, which otherwise could have removed some of the heat from the holes being drilled.

 

When drilling/punching large covercoat production sheets, it is necessary to compensate for the dimensional changes of the flexible circuit production sheet, which can amount to as much as 0.2%.

 

More Displays of Flexible Circuits with Partial Green Solder Mask

Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask 1

Flexible Printed Circuit (FPC) Flexible PCB With Partial Green Solder Mask 2

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Other Products
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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