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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation

Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation

  • Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation
  • Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation
  • Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation
  • Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation
  • Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation
Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0309-V3.09
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-9.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide 25μm + Polyimide Stiffener +3M Sticker Board Thickness: 0.20 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 2

Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)
 
General description
This is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application of PLC Automation.
 
Basic specifications
Base material: Polyimide 25μm + polyimide stiffener +3M sticker
Layer count: 2 layers
Type: Individual FPC
Format: 93mm x 44mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 0 μm
Solder mask / Legend: Yellow coverlay / No.
Final PCB height: 0.20 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
 

 
Features and benefits
Reliability increased;
Controllability of electrical parameter design;
Good oxidation resistance and good heat dissipation;
Powerful PCB capabilities support your research and development, sales and marketing;
Delivery on time higher than 98% on-time-delivery rate;
Quick CADCAM checking and free PCB quotation;
8000 types of PCB's per month;
 
Applications
industrial control touch remote control soft board, Tablet PC module soft board, mobile phone module flex board, Consumer electrostatic Bracelet soft board, capacitive touch screen / panel, medical equipment controller
 
Flexible Printed Circuit (FPC) Capability 2021

No.SpecificationsCapabilities
1Board TypeSingle layer, Doulbe layer, Multilayer, Rigid-Flex
2Base MaterialPI, PET
3Copper Weight0.5oz, 1oz, 2oz
4LED Maximum Size250 x 5000mm
5General Maximum Size250 x 2000mm
6Board Thickness0.03mm-3.0mm
7Thickness Tolerance±0.03mm
8Mininum Drill Hole0.05mm
9Maximum Drill Hole6.5mm
10Tolerance of Drill Hole±0.025mm
11Thickness of Hole Wall≧ 8 um
12Minimum Track/Gap of Single Layer Board0.025/0.03mm
13Minimum Track/Gap of Double Layer and Multilayer Board0.03/0.040mm
14Etching Tolerance±0.02mm
15Minimum Width of Silk Legend≧ 0.125mm
16Minimum Heigh of Silk Legend≧0.75mm
17Distance from Legend to Pad≧0.15mm
18Distance from Opening Solder Mask of Drill Coverlay to Track≧0.03mm
19Distance from Opening Solder Mask of Punching Coverlay to Track≧0.03mm
20Thickness of Immersion Nickel100-300u"
21Thickness of Immersion Gold1-3u"
22Thicnkess of Immersion Tin150-400u"
23Minimum Electrical Testing Pad0.2mm
24Minimum Tolerance of Outline(Normal Steel Mould Punch)±0.1mm
25Minimum Tolerance of Outline (Precision Steel Mould Punch)±0.05mm
26Mininum Radius of Bevel Angle (Outline)0.2mm
27Stiffner MaterialPI, FR-4, 3M Adhesive, PET, Steel Sheet
28RoHsYes
29Solder Mask ColourYellow, White, Black, Green

 
Components of a flexible circuit
A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.
Copper foil is available in two different types of copper: ED Copper and RA copper.
 
ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.
 
RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.
Copper foil is available in thickness of 12, 18, 35 and 70 μm.
 
The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:
High temperature resistance allows soldering operations without damaging the flexible circuits
Very good electrical properties
Good chemical resistance
Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.
 
Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.

 
 
Dual Layer Flexible Printed Circuit PCB (FPC) Built on Polyimide With Stiffener for PLC Automation 0

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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