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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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2-Layer Flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System

2-Layer Flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System

  • 2-Layer Flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System
  • 2-Layer Flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System
  • 2-Layer Flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System
  • 2-Layer Flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System
  • 2-Layer Flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System
2-Layer Flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0305-V3.05
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-7.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide 25μm + 0.3mm Stiffener Of FR-4 Board Thickness: 0.20 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 2

2-Layer Flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application of Embedded Operating System.

 

Basic specifications

Base material: Polyimide 25μm + 0.3mm stiffener of FR-4

Layer count: 2 layers

Type: Individual FPC

Format: 130mm x 15mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 0 μm

Solder mask / Legend: Yellow coverlay / white

Final PCB height: 0.20 mm

Standard: IPC 6012 Class 2

Packing: 100 pieces are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

 

2-Layer Flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System 0

 

Features and benefits

Excellent flexibility;

Reducing the volume;

Weight reduction;

Engineering design prevents problems from occurring in pre-production;

PCB manufacturing is strictly as per required specifications;

Great customer service;

Diversified shipping method: FedEx, DHL, TNT, EMS;

Prototype PCB capability;

Volume Production capability;

 

Applications

Laser head FPC, Mobile phone battery flex board, medical keypad soft board, LCD module, Industrial control computer soft board, consumer ETC (Electronic Toll Collection ) soft board

 

Specifications of Standard 1 Layer FCCL

Single side adhesiveless flexible copper clad laminate (SF201)
Specifications Thickness (µm) Copper Type Applications
Polyimide Film Copper Foil
SF201 0512SE 12.5 12 ED Motor, digital products etc.as univeral connector
SF201 0812SE 20 12 ED
SF201 1012SE 25 12 ED
SD201 0518SE 12.5 18 ED
SF201 0818SE 20 18 ED
SF201 1018SE 25 18 ED
SF201 0535SE 12.5 35 ED automotive electronics etc..
SF201 0835SE 20 35 ED
SF201 1035SE 25 35 ED
SF201 1070SE 25 70 ED
SF201 2070SE 50 70 ED Motor, digital products etc.as univeral connector
SF201 0512SR 12.5 12 RA
SF201 0812SR 20 12 RA
SF201 1012SR 25 12 RA
SF201 0518SR 12.5 18 RA
SF201 0818SR 20 18 RA
SF201 1018SR 25 18 RA

 

Components of a flexible circuit

A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.

Copper foil is available in two different types of copper: ED Copper and RA copper.

 

ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

 

RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

Copper foil is available in thickness of 12, 18, 35 and 70 μm.

 

The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:

High temperature resistance allows soldering operations without damaging the flexible circuits

Very good electrical properties

Good chemical resistance

Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.

 

Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.

 
 
 
 
2-Layer Flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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