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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers PCB RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210, RO4730, RO4360, RO3203

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10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions

10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions

  • 10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions
  • 10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions
10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-0071-V4.1
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-5.99 per piece
Packaging Details: Vacuum
Delivery Time: 6-7 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 10 Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Final Foil External: 1.oz Final Height Of PCB: 2.0 Mm ±10%
Surface Finish: Immersion Gold, 87% Solder Mask Color: No
Colour Of Component Legend: No Test: 100% Electrical Test Prior Shipment

10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Good day!

In the previous products, we’ve talked 4-layer RF PCB and 6-layer RF PCB. We have known that Rogers multilayer PCBs are made of every different core. So 10-layer RF PCB becomes simple now, is it right?

 

10-layer RF PCB is made on 5 cores of Rogers material. Since the final thickness will not be much thicker, so the thin core is usually used, such as 6.6mil RO4350B, 10mil RO4350B, 13.3mil RO4350B, 8mil RO4003C and12mil RO4003C etc.

 

Today this 10-layer PCB is on 5 cores of 10mil RO4350B combined by RO4450F prepreg.

It’s for the application of broadband wireless solutions. It's 2.0 mm thick, pads are immersion gold plated. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards are packed for shipment.

 

Features and benefits

1) Excellent dimensional stability.

2) Good high temperature and low temperature resistance.(-192℃-260℃)

3) Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

4) Engineering design prevents problems from occurring in preproduction.

5) DDU Door to door shipment with competitive shipping cost,

6) No MOQ, low cost for prototypes and samples.

 

Applications

RF transceiver, Communications relays, Low Noise Block, Splitter module

 

Parameter and data sheet

PCB SIZE 115 x 110mm=1PCS=1design
BOARD TYPE High Frequency PCB, Multilayer PCB
Number of Layers 10 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP TOP Layer: signal - 1/2oz foil + 25μm Cu
Core RO4350B -0.254mm
INT 1: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 2: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 3: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 4: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 5: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 6: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 7: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 8: mixed - 1/2oz foil
Core RO4350B -0.254mm
BOT Layer: signal - 1/2oz foil + 25μm Cu
TECHNOLOGY  
Minimum Trace and Space: 5.5mil/5mil
Minimum / Maximum Holes: 0.3/2.0mm
Number of Different Holes: 9
Number of Drill Holes: 7505
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL  
Glass Epoxy: RO4350B core 0.254mm(10mil), RO4450B PP 0.1mm(4mil)
Final foil external: 1oz
Final foil internal: 0.5oz
Final height of PCB: 2.0mm ±10%
PLATING AND COATING  
Surface Finish Electroless nickel over Immersion Gold (ENIG)( 0.05µm over 3µm nickel)
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated Through Hole(PTH), via tented. BGA package
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.
 
10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions 0

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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